Electro-optical device, method of manufacturing the same, and electronic apparatus

ABSTRACT

[Object] To provide an electro-optical device and an electronic apparatus comprising the electro-optical device capable of solving non-uniformity in electrical resistance in fixing portions and of causing no display problem such as deterioration of contrast, etc., by making pressing conditions of a display substrate and a relay substrate be equal all over the fixing portions.  
     [Solving Means] A planarization film  80  is formed between electrodes such as electrodes  74, 75  connected to wiring lines formed on a relay substrate such as a flexible substrate, etc., and a first interlayer insulating layer  284  is formed on the planarization film  80  and at ends of the electrodes  74, 75.  Further, a transparent electrode  77  is formed on the electrodes  74, 75  and on convex portions  79.

BACKGROUND OF THE INVENTION

[0001] 1. Field of Invention

[0002] The present invention relates to electro-optical devices andelectronic apparatuses. More specifically, the invention relates to anelectro-optical device including an organic electroluminescent materialand to an electronic apparatus including the electro-optical device.

[0003] 2. Description of Related Art

[0004] The related art includes color electro-optical devices in whichlight-emitting elements made of light emitting material, such as organicfluorescent material, are sandwiched between pixel electrodes (anodes)and cathodes, in particular an organic electroluminescence (organic EL)display device employing organic EL material as the light emittingmaterial. A related art electro-optical device (the organic EL displayelement) is summarized below.

[0005]FIG. 13 is a schematic illustrating the wiring structure of therelated art electro-optical device. As shown in FIG. 13, a plurality ofscanning lines 901, a plurality of signal lines 902 extending in thedirection of intersecting the scanning lines 901 and a plurality oflight-emitting power source wiring lines 903 extending in parallel tothe signal lines 902 are arranged in the related art electro-opticaldevice, and a pixel region A is provided at each intersection of thescanning lines 901 and the signal lines 902. Each of the signal lines902 is connected to a data line driving circuit 904 comprising shiftregisters, level shifters, video lines and analog switches. Each of thescanning lines 901 is connected to a scanning line driving circuit 905comprising shift registers and level shifters.

[0006] Further, each of the pixel regions A is provided with a switchingthin film transistor 913 a gate electrode of which is supplied throughthe scanning line 901 with scanning signals, a holding capacitor Cap tohold image signals supplied through the switching thin film transistor913 from the signal line 902, a current thin film transistor 914 a gateelectrode of which is supplied with image signal held by the holdingcapacitor Cap, a pixel electrode 911 into which driving current flowfrom light-emitting power source wiring lines 903 when beingelectrically connected to the light-emitting power source wiring lines903 through the current thin film transistor 914, and a light-emittinglayer 910 sandwiched between the pixel electrode 911 and a cathode 912.The cathode 912 is connected to a power source circuit 931 for cathode.

[0007] The aforementioned light-emitting layer 910 includes three typesof light-emitting elements; a light-emitting layer 910R emitting a redlight, a light-emitting layer 910G emitting a green light and alight-emitting layer 910B emitting a blue light. The respectivelight-emitting layers 910R, 910G, 910B are arranged in striped shapes.Further, each of the light-emitting power source wiring lines 903R,903G, 903B connected respectively to the light-emitting layers 910R,910G, 910B through the current thin film transistors 914 is connected toa light-emitting power source circuit 932. The light-emitting powersource wiring lines are arranged for every color, because the drivingpotentials of the light-emitting layers 910 are different for everycolor.

[0008] In the above constitution, when scanning signals are supplied tothe scanning lines 901 to turn on the switching thin film transistors913, the electric charge corresponding to image signals supplied to thesignal lines 902 at that time is held in the holding capacitors Cap. TheON/OFF state of the current thin film transistors 914 is determined inaccordance with the quantity of electric charge held in the holdingcapacitors Cap. In addition, current flow through the current thin filmtransistors 914 from the light-emitting power source wiring lines 903R,903G, 903B to the pixel electrodes 911, and driving current flow throughthe light-emitting layer 910 to the cathode 912. At that time, thequantity of emitted light corresponding to that of current flowingthrough the light-emitting layer 910 is obtained.

SUMMARY OF THE INVENTION

[0009] The electro-optical device shown in FIG. 13 may include thescanning lines 901, the signal lines 902, the cathode 912, thelight-emitting power source wiring lines 903 (903R, 903G, 903B), thescanning line driving circuit 905 and the pixel regions A which areformed on a transparent substrate (a display substrate) such as a glasssubstrate, and the power source circuit 931 for cathode, thelight-emitting power source circuit 932, the data line driving circuit904 and the like are arranged on a flexible substrate (a relaysubstrate) having flexibility.

[0010] In case of such constitution, it is required that the flexiblesubstrate is fixed to the transparent substrate, and then the electricalcommunication of the scanning lines 901, the signal lines 902, thecathode 912 and the light-emitting power source wiring lines 903 isexecuted with the circuits formed on the flexible substrate. Thefixation and the electrical connection of the transparent substrate andthe flexible substrate are accomplished by arranging an anisotropicconductive film containing conductive particles between the transparentsubstrate and the flexible substrate and then pressing the flexiblesubstrate onto the transparent substrate.

[0011] In order to make the light-emitting layer 910 provided in theaforementioned electro-optical device stably emit a light, it isrequired to make variation in potential of the driving current appliedto the pixel electrodes 911 from the light-emitting power source wiringlines 903 as small as possible. Specifically, the electro-optical deviceshown in FIG. 13 is a current driven electro-optical device, and inorder to reduce or prevent defects in display such as non-uniformity ofdisplay, deterioration of contrast and the like, it is necessary togreatly suppress a voltage drop due to a wiring resistance of thecathode 912 and the light-emitting power source wiring lines 903 and thelike. In this regard, the cathode 912 and the light-emitting powersource wiring lines 903 are formed to have wider widths than those ofthe scanning lines 901 and the signal lines 902.

[0012] When the transparent substrate and the flexible substrate arefixed to each other, in order to obtain the uniformity in electricalresistance mainly generated in the pressing portions, it is required tomake the pressing conditions equal all over the fixing portions. Inorder to satisfy this requirement, it is necessary to make the shape ofterminals provided in the fixing portions and connected to various typesof wiring lines described above equal.

[0013] However, as described above, since the electro-optical deviceshown in FIG. 13 is a current driven electro-optical device, it isdifficult to narrow the line widths of the cathode 912 and thelight-emitting power source wiring lines 903 in consideration of thevoltage drop rendered due to the wiring resistance and the like.Further, since the numbers of the scanning lines 901 and the signallines 902 are large and it is necessary to obtain the thinness of lineand the narrowness of pitch in order to arrange all of the lines, it isalso difficult to make the line width of the scanning lines 901 and thesignal lines 902 as wide as the line widths of the cathode 912 and thelight-emitting power source wiring lines 903.

[0014] The present invention addresses the above and/or other problems,and provides an electro-optical device capable of addressing or solvingnon-uniformity in electrical resistance of the fixing portions andcausing no display problem, such as deterioration of contrast, etc., bymaking the pressing conditions of the display substrate and the relaysubstrate equal all over the fixing portions, and an electronicapparatus including an electro-optical device.

[0015] In order to address or solve the above, a method of manufacturingan electro-optical device according to the present invention is providedin which external connection terminals are formed. The method includesforming the external connection terminals by applying liquid materialcontaining conductive material.

[0016] Further, an insulating film having convex portions is formed onthe external connection terminals, and the liquid material is applied toregions defined by the convex portions.

[0017] Furthermore, the liquid material is applied using an inkjetmethod.

[0018] Furthermore, the present invention provides an electro-opticaldevice manufactured using the aforementioned manufacturing method.

[0019] Furthermore, the present invention provides an electronicapparatus including the electro-optical device described above.

BRIEF DESCRIPTION OF THE DRAWINGS

[0020]FIG. 1 is an exploded perspective view schematically illustratingan electro-optical device according to an exemplary embodiment of thepresent invention;

[0021]FIG. 2 is a cross-sectional view illustrating a state where arelay substrate 30 and a display substrate 20 are fixed to each otherthrough an anisotropic conductive film 40;

[0022]FIG. 3 is a schematic illustrating a wiring structure of anelectro-optical device according to an exemplary embodiment of thepresent invention;

[0023]FIG. 4 is a schematic plan view of the electro-optical device ofthe present exemplary embodiment;

[0024]FIG. 5 is a cross-sectional view taken along plane A-A′ in FIG. 4;

[0025]FIG. 6 is a top view of peripheries of a fixing portion 65 shownin FIG. 4;

[0026]FIG. 7 is a cross-sectional view of a second external connectionterminal 66 c and a second external connection terminal 70 taken alongplane B-B′ in FIG. 6;

[0027]FIG. 8 is an enlarged schematic of the external connectionterminal 70 in FIG. 7;

[0028]FIG. 9 is an enlarged schematic of the second external connectionterminals 70, 70 in which first interlayer insulating layer 284 isformed to be thick;

[0029]FIG. 10 is an enlarged schematic of the first external connectionterminals 70, 70 in which the first interlayer insulating layer 284 isformed thick and a planarization film is formed between electrodes 74,75;

[0030]FIG. 11 is a schematic illustrating an example of an electronicapparatus including the electro-optical device according to an exemplaryembodiment of the present invention;

[0031]FIG. 12 is a perspective view illustrating a mobile phone asanother electronic apparatus;

[0032]FIG. 13 is a schematic illustrating a wiring structure of arelated art electro-optical device;

[0033]FIG. 14 is a schematic illustrating a structure of an applicationapparatus;

[0034]FIG. 15 is a plan view illustrating a head unit;

[0035]FIG. 16 is a flow chart illustrating an exemplary embodiment of apattern formation method according to the present invention;

[0036] FIGS. 17(a)-17(c) are schematics illustrating an exemplaryembodiment of a pattern formation method according to the presentinvention;

[0037] FIGS. 18(a)-18(c) are schematics illustrating an exemplaryembodiment of a pattern formation method according to the presentinvention;

[0038] FIGS. 19(a) and 19(b) are schematics illustrating a state whereliquid droplets are arranged based on bit map data set up on asubstrate;

[0039] FIGS. 20(a) and 20(b) are schematics illustrating a state whereliquid droplets are arranged based on bit map data set up on asubstrate;

[0040] FIGS. 21(a) and 21(b) are schematics illustrating a state whereliquid droplets are arranged based on bit map data set up on asubstrate;

[0041]FIG. 22(a) is a schematic illustrating another exemplaryembodiment of a state where liquid droplets are arranged based on bitmap data set up on a substrate;

[0042]FIG. 23 is a schematic illustrating another exemplary embodimentof a state where liquid droplets are arranged based on bit map data setup on a substrate;

[0043] FIGS. 24(a) and 24(b) are schematics illustrating anotherexemplary embodiment of the pattern formation method according to thepresent invention;

[0044]FIG. 25 is an exploded perspective view illustrating an examplewhere an electro-optical device according to an exemplary embodiment ofthe present invention, is the electro-optical device being applied to aplasma type display device;

[0045]FIG. 26 is a side view illustrating a head unit;

[0046]FIG. 27 is a front view illustrating the head unit;

[0047]FIG. 28 is a cross-sectional view illustrating the head unit;

[0048]FIG. 29 is a perspective view illustrating the head unit.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

[0049] An electro-optical device and an electronic apparatus accordingto an exemplary embodiment of the present invention is described indetail with reference to the drawings. Further, in order to makerespective layers or members recognizable in the respective drawingswhich are referred to in the following description, the respectivelayers or the respective members are represented in different scales.

[0050]FIG. 1 is an exploded perspective view schematically illustratingan electro-optical device according to an exemplary embodiment of thepresent invention. As shown in FIG. 1, the electro-optical device 10 ofthe present exemplary embodiment largely comprises a display substrate20 and a relay substrate 30 connected to the display substrate 20. Thedisplay substrate 20 is an active matrix type organic EL deviceemploying thin film transistors as switching elements.

[0051] This display substrate 20 includes a plurality of scanning lines21, and a plurality of signal lines 22 extending in a direction in whichthe scanning lines 21 are intersected. In addition, the displaysubstrate 20 is provided with a display element 20 a in which aplurality of light-emitting elements are formed. Further, although notshown in FIG. 1, power source lines and a cathode are formed on thedisplay substrate 20. Furthermore, external connection terminals 27 forthe scanning lines 21, the signal lines 22 and the power source linesand cathode not shown are formed at an end of the display substrate 20,respectively.

[0052] Further, the electro-optical device 10 shown in FIG. 1schematically illustrates only significant components, and thus itshould be noted that the real scanning lines 21, the real signal lines22 and the real external connection terminals 27 are formed at a verysmall pitch on the display substrate 20. Furthermore, the connectingstate of the external connection terminals 27 and the scanning lines 21is omitted in FIG. 1.

[0053] The relay substrate 30 has a plurality of wiring lines 32 formedon a base substrate 31 having flexibility, and a semiconductor chip 33is mounted at a predetermined position on the relay substrate 30. Atends of wiring line 32, external connection terminals 34 to electricallyconnect to wiring lines such as the scanning lines 21 and the signallines 22 formed on the display substrate 20 are formed. Further,although only the semiconductor chip 33 is mounted on the relaysubstrate 30 in FIG. 1, resistors, condensers or other chip componentsmay be mounted at predetermined positions other than the positions wherethe semiconductor chip 33 is mounted. Furthermore, the wiring lines 32and the external connection terminals 34 formed on the relay substrate30 are also schematically illustrated with enlarged pitches and withsimplified structures, in order to facilitate understanding of thestructures.

[0054] As shown in FIG. 1, the relay substrate 30 is fixed to thedisplay substrate 20 through an anisotropic conductive film 40. At thattime, the external connection terminals 34 of the relay substrate 30 areelectrically connected to the external connection terminals 27 of thedisplay substrate 20 through the anisotropic conductive film 40. Theanisotropic conductive film 40 is a high polymer conductive film usedfor providing anisotropy between a pair of terminals to electricallyconnect them in a bundle. The anisotropic conductive film 40 is formedby dispersing a plurality of conductive particles 41 b in athermoplastic or thermosetting adhesive resin 41 a, for example, asshown in FIG. 2.

[0055]FIG. 2 is a cross-sectional view illustrating a state where therelay substrate 30 and the display substrate 20 are fixed to each otherthrough the anisotropic conductive film 40. As shown in FIG. 2, sincethe conductive particles 41 b are sandwiched between the externalconnection terminals 27 formed on the display substrate 20 and theexternal connection terminals 34 formed on the relay substrate 30, theexternal connection terminals 27 and the external connection terminals34 that are relay wiring lines are electrically connected to each other.On the other hand, the electric communication cannot be accomplished inparts other than the parts in which the external connection terminals 27and the external connection terminals 34 are formed, because anyconnection terminal does not exist even when the conductive particles 41b are sandwiched. In this regard, the electrical communication can beaccomplished only between the external connection terminals 27 and theexternal connection terminals 34.

[0056] In order to fix the display substrate 20 and the relay substrate30 using the anisotropic conductive film 40, the display substrate 20 ismounted on a mounting support having a guide plate with a rough surface(all not shown), and then the display substrate 20 is vacuum-adsorbed.At that time, the display substrate 20 is mounted on the mountingsupport such that at least the part of the relay substrate 30 to befixed to the display substrate 20 is positioned above the guide plate.The guide plate with a rough surface is used in order to reduce thetemperature given to the display substrate 20 by reducing the contactarea of the guide plate and the display substrate 20 to suppress theheat dissipation from the guide plate.

[0057] When the display substrate 20 is completely mounted on themounting support, the anisotropic conductive film 40 is adhered to theparts of the display substrate 20 to which the relay substrate 30 isfixed, and then the relay substrate 30 is positioned such that thesurface on which the semiconductor chip 33 is mounted faces downward andthe external connection terminals 34 are positioned above theanisotropic conductive film 40. When the above processes are completed,by heating and pressing the back surface of the surface on which theexternal connection terminals 34 are formed using a heating/pressinghead not shown, the electric communication between the externalconnection terminals 34 and the external connection terminals 27 formedon the display substrate 20 is established and the relay substrate 30 isfixed to the display substrate 20. At that time, the temperature givento the relay substrate 30 and the display substrate 20 from theheating/pressing head is about a hundred and several tens to severalhundred ° C. and the given pressure is about several MPa. According tothe above processes, the relay substrate 30 can be fixed to the displaysubstrate 20.

[0058] Next, a wiring structure of the electro-optical device 10according to the present exemplary embodiment is described in detail.FIG. 3 is a schematic illustrating the wiring structure of theelectro-optical device according to an exemplary embodiment of thepresent invention. As shown in FIG. 3, the electro-optical device 10includes a plurality of scanning lines 21, a plurality of signal lines22 extending in a direction in which the scanning lines 21 areintersected and a plurality of light-emitting power source wiring lines23 extending in parallel to the arranged signal lines 22, respectively.A pixel region A is provided in each intersection of the scanning lines21 and the signal lines 22.

[0059] A data line driving circuit 33 a including shift registers, levelshifters, video lines and analog switches are connected to each signalline 22. In addition, an inspection circuit 25 including thin filmtransistors is connected to each signal line 22. Furthermore, a scanningline driving circuit 24 including shift registers and level shifters isconnected to each scanning line 21.

[0060] Furthermore, each of the pixel regions A is provided with aswitching thin film transistor 52, a holding capacitor Cap, a currentthin film transistor 53, a pixel electrode 51, a light-emitting layer 50and a cathode 26. The switching thin film transistor 52 whose gateelectrode is connected to the scanning line 21, is driven in accordancewith scanning signals supplied from the scanning line 21 so as to beturned on or off. The holding capacitor Cap holds image signals suppliedfrom the signal line 22 through the switching thin film transistor 52.

[0061] A gate electrode of the current thin film transistor 53 isconnected to the switching thin film transistor 52 and the holdingcapacitor Cap, and the image signal held by the holding capacitor Cap issupplied to the gate electrode. The pixel electrode 51 is connected tothe current thin film transistor 53, and when the pixel electrode iselectrically connected to the light-emitting power source wiring line 23through the current thin film transistor 53, the driving current flowsinto the pixel electrode from the light-emitting power source wiringline 23. The light-emitting layer 50 is sandwiched between the pixelelectrode 51 and the cathode 26.

[0062] The light-emitting layer 50 includes three types oflight-emitting elements; a light-emitting layer 50R emitting a redlight, a light-emitting layer 50G emitting a green light and alight-emitting layer 50B emitting a blue light. The respectivelight-emitting layers 50R, 50G, 50B are arranged in striped shapes. Inaddition, light-emitting power source wiring lines 23R, 23G, 23Bconnected to the respective light-emitting layers 50R, 50G, 50B throughthe current thin film transistor 53 are connected to the light-emittingpower source circuit 33 c, respectively. The light-emitting power sourcewiring lines 23R, 23G, 23B are wired for every color, because thedriving potentials of the light-emitting layers 50R, 50G, 50B aredifferent for every color.

[0063] Furthermore, in the electro-optical device of the presentembodiment, electrostatic capacitors C, are formed between the cathode26 and the light-emitting power source wiring lines 23R, 23G, 23B. Whenthe electro-optical device 10 is driven, electric charge is accumulatedin the electrostatic capacitors C₁. When the potential of the drivingcurrent flowing through the respective light-emitting power sourcewiring lines 23 in the course of driving the electro-optical device 10varies, the accumulated charge is discharged into the respectivelight-emitting power source wiring lines 23 to suppress the variation indriving current. Accordingly, the image display by the electro-opticaldevice 10 can be normally maintained.

[0064] Furthermore, in this electro-optical device 10, when the scanningsignals are supplied from the scanning lines 21 to turn on the switchingthin film transistor 52, the potential of the signal lines 22 at thattime is held at the holding capacitors Cap, and the ON/OFF state of thecurrent thin film transistors 53 is determined in accordance with thepotential held at the holding capacitors Cap. In addition, the drivingcurrent flows through channels of the current thin film transistors 53from the light-emitting power source wiring lines 23R, 23G, 23B to thepixel electrodes 51, and current also flows through the light-emittinglayers 50R, 50G, 50B to the cathode 26. At this time, a quantity ofemitted light corresponding to the quantity of current flowing throughthe light-emitting layers 50 is obtained from the light-emitting layers50.

[0065] Next, a specific configuration of the electro-optical device 10according to the present exemplary embodiment is described withreference to FIG. 4 and FIG. 5. FIG. 4 is a schematic plan view of theelectro-optical device according to the present exemplary embodiment,and FIG. 5 is a cross-sectional view taken along plane A-A′ in FIG. 4.As shown in FIG. 4, the electro-optical device 10 according to thepresent exemplary embodiment generally includes a substrate 60, a pixelelectrode group region (not shown), light-emitting power source wiringlines 23 (23R, 23G, 23B) and a display pixel portion 61 (within a frameof a dashed line in the drawing).

[0066] The substrate 60 is a transparent substrate, for example, made ofglass and the like. The pixel electrode group region is a region inwhich the pixel electrodes (not shown) connected to the current thinfilm transistors 53 shown in FIG. 3 are arranged in a matrix on thesubstrate 60. The light-emitting power source wiring lines 23 (23R, 23G,23B) are arranged around the pixel electrode group region, as shown inFIG. 4, and are connected to the respective pixel electrodes. Thedisplay pixel portion 61 is positioned at least above the pixelelectrode group region and has a substantially rectangular shape in aplan view. This display pixel portion 61 is divided into a substantialdisplay region (or, may be referred to as an effective display region)62 (within a frame indicated by a chain double-dashed line) at thecenter and a dummy region 63 disposed outside of the substantial displayregion 62 (a region between the dashed chain line and the chaindouble-dashed line).

[0067] Furthermore, the scanning line driving circuits 24 are disposedon both sides of the substantial display region 62 in the drawing. Thesescanning line driving circuits 24 are provided on the lower side (thesubstrate 60 side) of the dummy region 63. Furthermore, control signalwiring lines 24 a for the scanning line driving circuit and power sourcewiring lines 24 b for the scanning line driving circuit which areconnected to the scanning line driving circuit 24 are provided on thelower side of the dummy region 63. Furthermore, the aforementionedinspection circuit 25 is disposed on the upper side of the substantialdisplay region 62 in the drawing. This inspection circuit 25 is disposedon the lower side (the substrate side 2) of the dummy region 63, and itis possible to inspect the quality or the defect of the electro-opticaldevice during its manufacture or during its shipment by using thisinspection circuit 25.

[0068] As shown in FIG. 4, the light-emitting power source wiring lines23R, 23G, 23B are disposed at the periphery of the dummy region 63. Eachof the light-emitting power source wiring lines 23R, 23G, 23B extendsalong the control signal wiring lines 24 a for scanning line drivingcircuit from the lower side of the substrate 60 in FIG. 2 to the upperside in FIG. 4, is bent from a position at which the control signalwiring lines 24 a for the scanning line driving circuit are stopped,extends along the outside of the dummy region 63, and is connected tothe pixel electrodes (not shown) in substantial display region 62.Further, a cathode wiring line 26 a connected to the cathode 26 isformed on the substrate 60. This cathode wiring line 26 a is formedsubstantially in a U-shape in a plan view to surround the light-emittingpower source wiring lines 23R, 23G, 23B.

[0069] Next, as shown in FIG. 5, a circuit portion 11 is formed on thesubstrate 60, and a display pixel portion 61 is formed on the circuitportion 11. In addition, sealing material 13 surrounding the displaypixel portion 61 in a ring shape is formed on the substrate 60, and asealing substrate 14 is provided on the display pixel portion 61. Thesealing substrate 14 is adhered to the substrate 60 through the sealingmaterial 13, and is made of glass, metal, resin and the like. Anabsorbent 15 is adhered to the back surface of the sealing substrate 14so that water or oxygen came to be mixed in a space between the displaypixel portion 61 and the sealing substrate 14 can be adsorbed. Further,a getter may be used in place of the adsorbent 15. Furthermore, thesealing material 13 is made of, for example, thermosetting resin or UVcuring resin, and it is preferable that the sealing material made ofepoxy resin that is one type of thermosetting resin in particular.

[0070] The central portion of the circuit portion 11 is provided with apixel electrode group region 11 a. The pixel electrode group region 11 acomprises the current thin film transistors 53 and the pixel electrodes51 connected to the current thin film transistors 53. The current thinfilm transistors 53 are formed to be buried in a base protective layer281, a second interlayer insulating layer 283 and a first interlayerinsulating layer 284 which are stacked on the substrate 60, and thepixel electrodes 51 are formed on the first interlayer insulating layer284. The light-emitting power source wiring lines 23 (23R, 23G, 23B) areconnected to one side of electrodes (source electrodes) connected to thecurrent thin film transistors 53 and formed on the second interlayerinsulating film 283. In addition, although the holding capacitors Capand the switching thin film transistors 52 are also formed on thecircuit portion 11, these are not shown in FIG. 5. Furthermore, thesignal lines 22 are not shown in FIG. 5.

[0071] Next, in FIG. 5, both sides of the pixel electrode group region11 a in the drawing are provided with the aforementioned scanning linedriving circuit 24. The scanning line driving circuit 24 shown in FIG. 4includes N channel type or P channel type thin film transistors 24 cconstituting inverters included in the shift registers, the thin filmtransistors 24 c have the same structure as the aforementioned currentthin film transistors 53, except that they are not connected to thepixel electrodes 51. Further, although the illustration of theinspection circuit 25 is omitted in FIG. 5, the inspection circuit 25also includes thin film transistors, similarly. The thin filmtransistors included in the inspection circuit 25 have the samestructure as the current thin film transistors 53, except that they arenot connected to dummy pixel electrodes 51′ which is described below.

[0072] As shown in FIG. 5, the control signal wiring lines 24 a for thescanning line driving circuit are formed on the base protective layer281 outside the scanning line driving circuit 24 in the drawing. Inaddition, the power source wiring lines 24 b for the scanning linedriving circuit are formed on the second interlayer insulating layer 283outside the control signal wiring lines 24 a for the scanning linedriving circuit. Furthermore, the light-emitting power source wiringlines 23 are formed outside the power source wiring lines 24 b for thescanning line driving circuit. The light-emitting power source wiringlines 23 employ a double wiring structure including two wiring lines andare arranged outside the display pixel portion 61 as described above. Byemploying the double wiring structure, it is possible to reduce thewiring line resistance.

[0073] For example, the light-emitting power source wiring line 23R forred color on the left side in FIG. 5 includes a first wiring line 23R₁formed on the base protective layer 281 and a second wiring line 23R₂formed on the first wiring line 23R₁ through the second interlayerinsulating film 283. The first wiring line 23R, and the second wiringline 23R₂ are connected to each other through a contact hole 23R₃penetrating the second interlayer insulating layer 283 as shown in FIG.2. Like this, the first wiring line 23R₁ is formed at the same levelposition as the cathode wiring line 26 a and the second interlayerinsulating layer 283 is disposed between the first wiring line 23R₁ andthe cathode wiring line 26 a. Furthermore, as shown in FIG. 5, thecathode wiring line 26 a is electrically connected to a cathode wiringline 26 b formed on the second interlayer insulating layer 283 through acontact hole, and the cathode wiring line 26 a also has the doublewiring structure. Similarly, the second wiring line 23R₂ is formed atthe same level position as the cathode wiring line 26 b, and the firstinterlayer insulating layer 284 is disposed between the first wiringline 23R₂ and the cathode wiring line 26 b. By constituting suchstructure, second electrostatic capacitors C₂ are formed between thefirst wiring line 23R₁ and the cathode wiring line 26 a and between thesecond wiring line 23R₂ and the cathode wiring line 26 b.

[0074] Similarly, the light-emitting power source wiring lines 23G, 23Bfor green color and blue color on the right side in FIG. 5 also employthe double wiring structure. The light-emitting power source wiringlines 23G, 23B include first wiring lines 23G₁, 23B₁ which are formed onthe base protective layer 281 and second wiring lines 23G₂, 23B₂ whichare formed on the second interlayer insulating layer 283, respectively.The first wiring lines 23G₁, 23B₁ and the second wiring lines 23G₂, 23B₂are connected to each other through contact holes 23G₃, 23B₃ penetratingthe second interlayer insulating layer 283 as shown in FIG. 4. Inaddition, the second electrostatic capacitors C₂ are formed between thefirst wiring line 23B₁ for blue color and the cathode wiring line 26 aand between the second wiring line 23B₂ for blue color and the cathodewiring line 26 b.

[0075] It is preferable for the gap between the first wiring line 23R₁and the second wiring line 23R₂ to be, for example, within a range of0.6 to 1.0 μm. If the gap is less than 0.6 μm, the parasitic capacitancebetween the source metal and the gate metal having potentials differentfrom the signal lines 22 and the scanning lines 21 is increased, it isnot preferable for the gap to be less than 0.6 μm. For example, manylocations where the source metal and the gate metal intersect each otherare in the substantial display region 62, and if the parasiticcapacitance at such locations becomes large, it may undesirably causethe time delay of the image signal. As a result, the image signalscannot be written to the pixel electrodes 51 within a predeterminedtime, which causes deterioration of contrast. It is preferable that thesecond interlayer insulating layer 283 sandwiched between the firstwiring line 23R₁ and the second wiring line 23R₂ is made of, forexample, SiO₂ and the like. However if the second interlayer insulatinglayer 283 is formed to be 1.0 μm or more thick, it may cause undesirablydestruction of the substrate 60 due to stress of SiO₂.

[0076] In addition, the cathode 26 extending from the display pixelportion 61 is formed on the upper side of the respective light-emittingpower source wiring lines 23R. In this regard, the second wiring line23R₂ of the respective light-emitting power source wiring lines 23R isdisposed to face the cathode 26 with the first interlayer insulatinglayer 284 sandwiched therebetween, and as a result, the aforementionedfirst electrostatic capacitor C₁ is formed between the second wiringline 23R₂ and the cathode 26. Here, it is preferable that the gapbetween the second wiring line 23R₂ and the cathode 26 is, for example,within a range of 0.6 to 1.0 μm. If the gap is less than 0.6 μm, theparasitic capacitance increases between the pixel electrodes and thesource metal having different potentials such as the pixel electrodesand the source metal, which causes the wiring line delay in the signallines employing the source metal. As a result, the image signals cannotbe written within a predetermined time, which causes deterioration ofcontrast. It is preferable that the first interlayer insulating layer284 sandwiched between the second wiring line 23R₂ and the cathode 26 ismade of, for example, SiO₂, acryl resin and the like. However, if SiO₂is formed to be 1.0 μm thick or more, the substrate 60 may be destructeddue to stress. Furthermore, the acryl resin can be formed to be about2.0 μm thick, but since the acryl resin has a property to expand byadsorbing water, the pixel electrodes formed thereon may be destroyedundesirably.

[0077] Like this, in the display substrate 20, since the firstelectrostatic capacitor C₁ is provided between the light-emitting powersource wiring lines 23 and the cathode 26, when the potential of thedriving current flowing through the light-emitting power source wiringlines 23 varies, the electric charge accumulated in the firstelectrostatic capacitor C₁ is supplied to the light-emitting powersource wiring lines 23 and the lack of potential of the driving currentcan be complemented by the electric charge to suppress the variation ofpotential. Accordingly, it is possible to normally maintain the imagedisplay of the light-emitting device 1. Specifically, since thelight-emitting power source wiring lines 23 and the cathode 26 areopposite to each other outside the display pixel portion 61, the gapbetween the light-emitting power source wiring lines 23 and the cathode26 can be made smaller to increase the quantity of charge accumulated inthe first electrostatic capacitor C₁, and the variation in potential ofthe driving current can be made smaller to stably perform the imagedisplay. Furthermore, the light-emitting power source wiring lines 23have the double wiring structure including the first wiring lines andthe second wiring lines and the second electrostatic capacitor C₂ isprovided between the first wiring lines and the cathode wiring line, sothat the charge accumulated in the second electrostatic capacitors C₂ isalso supplied to the light-emitting power source wiring lines 23.Therefore, it is possible to suppress the variation in potential and itis also possible to more stably maintain the image display of thelight-emitting device 1.

[0078] Next, light-emitting layers 50 and bank portions (insulatingportions) 122 are formed in the substantial pixel region 62 of thedisplay pixel portion 61. The light-emitting layer 50 is stacked on eachof the pixel electrodes 51 as shown in FIG. 5. In addition, the bankportions 122 are provided between each of the pixel electrodes 51 andeach of the light-emitting layers 50 to define each of thelight-emitting layers 50. The bank portion 122 include a stackedstructure of an inorganic bank layer 122 a positioned close to thesubstrate 60 and an organic bank layer 122 b positioned away from thesubstrate 60. Further, a light-shielding layer may be disposed betweenthe inorganic bank layer 122 a and the organic bank layer 122 b.

[0079] The inorganic and organic bank layers 122 a, 122 b are formed toextend onto the edge portion of the pixel electrodes 51, and theinorganic bank layers 122 a are formed to extend more toward the centersof the pixel electrodes 51 than the organic bank layers 122 b. Further,it is preferable that the inorganic bank layers 122 a be made ofinorganic material such as, for example, SiO₂, TiO₂, or SiN.Furthermore, the film thickness of the inorganic bank layers 122 a ispreferably within a range of 50 to 200 nm and more preferably 150 nm.When the film thickness is less than 50 nm, since the inorganic banklayers 122 a become thinner than a hole injecting/carrying layer whichis described below, and thus the planarity of the holeinjecting/carrying layer cannot be ensured, it is not preferable.Furthermore, when the film thickness is more than 200 nm, since the stepheight due to the inorganic bank layers 122 a increases and thus theplanarity of the light-emitting layer (which is described below) stackedon the hole injecting/carrying layer cannot be ensured. Hence, it is notpreferable that the film thickness be more than 200 nm.

[0080] Furthermore, the organic bank layers 122 b are made of generalresists, such as acryl resin or polyimide resin. The thickness of theorganic bank layers 122 b is preferably within a range of 0.1 to 3.5 μmand more preferably about 2 μm. If the thickness is less than 0.1 μm,since the thickness of the organic bank layers 122 b is thinner than thetotal thickness of the hole injecting/carrying layer and thelight-emitting layer and the light-emitting layer may overflowundesirably from an upper opening, it is not preferable. Furthermore, ifthe thickness exceeds 3.5 μm, the step height due to the upper openingportion increases, and thus the step coverage of the cathode 26 formedon the organic bank layers 122 b cannot be ensured, which is notpreferable. Furthermore, when the thickness of the organic bank layers122 b is 2 μm or more, the insulation between the cathode 26 and thepixel electrodes 51 can be enhanced, which is preferable.

[0081] In this regard, the light-emitting layers 50 are formed to bethinner than the bank portions 122.

[0082] Furthermore, regions having a lyophilic property and regionshaving a lyophobic property are formed around the bank portions 122. Theregions having a lyophilic property are the inorganic bank layers 122 aand the pixel electrodes 51, and lyophilic radicals such as hydroxylradicals are introduced into these regions by plasma treatment usingoxygen as a reaction gas. Furthermore, the regions having a lyophobicproperty are the organic bank layers 122 b, and lyophobic radicals suchas fluorine are introduced by plasma treatment using 4-fluoromethane asa reaction gas.

[0083] The light-emitting layers 50 are stacked on the holeinjecting/carrying layers (not shown) stacked on the pixel electrodes51. In addition, in the present specification, a constitution includingthe light-emitting layers 50 and the hole injecting/carrying layers isreferred to as a functional layer, and a constitution including thepixel electrodes 51, the functional layer and the cathode 26 is referredto as a light-emitting element. The hole injecting/carrying layers havea function of injecting holes into the light-emitting layers 50 and alsoa function of carrying the holes in the hole injecting/carrying layers.By providing these hole injecting/carrying layers between the pixelelectrodes 51 and the light-emitting layers 50, the characteristics ofthe element such as light emitting efficiency or life time of thelight-emitting layers 50 are improved. In addition, in thelight-emitting layers 50, the holes injected from the holeinjecting/carrying layers and electrons from the cathode 26 are coupledto generate a fluorescent light. The light-emitting layers 50 have threetypes of light-emitting layers; a light-emitting layers to emit a red(R) light, a light-emitting layer to emit a green (G) light and alight-emitting layer to emit a blue (B) light, and as shown in FIG. 3and FIG. 4, the respective light-emitting layers are arranged in astriped shape.

[0084] Next, as shown in FIG. 5, dummy light-emitting layers 210 anddummy bank portions 212 are formed in the dummy region 63 of the displaypixel portion 61. The dummy bank portion 212 has a stacked structure ofdummy inorganic bank layers 212 a positioned close to the substrate 60and dummy organic bank layers 212 b positioned away from the substrate60. The dummy inorganic bank layers 212 a are formed on the wholesurface of the dummy pixel electrodes 51′. Furthermore, the dummyorganic bank layers 212 b are formed between the pixel electrodes 51,similar to the organic bank layers 122 b. In addition, the dummylight-emitting layers 210 are formed on the dummy pixel electrodes 51′through the dummy inorganic bank layers 212 a.

[0085] The dummy inorganic bank layers 212 a and the dummy organic banklayers 211 b are made of the same material as the aforementionedinorganic and organic bank layers 122 a, 122 b, and have the same filmthickness as the aforementioned inorganic and organic bank layers 122 a,122 b. Furthermore, the dummy light-emitting layers 210 are stacked onthe dummy hole injecting/carrying layers (not shown), and the materialsor the film thickness of the dummy hole injecting/carrying layers andthe dummy light-emitting layers is the same as that of theaforementioned hole injecting/carrying layers and the light-emittinglayers 50. Therefore, similar to the aforementioned light-emittinglayers 50, the dummy light-emitting layers 210 are formed to be thinnerthan the dummy bank portions 212.

[0086] By disposing the dummy region 63 around the substantial displayregion 62, it is possible to make the uniform thickness of thelight-emitting layers 50 in the substantial display region 62. Thus itis possible to reduce or suppress the non-uniformity of display. Thatis, by disposing the dummy region 63, it is possible to make the uniformdrying condition of ink composition ejected in forming a display elementusing the inkjet method in the substantial display region 62, it isunnecessary to be concerned with deviation in thickness of thelight-emitting layers 50 being rendered in the edge portions of thesubstantial display region 62.

[0087] Next, the cathode 26 is formed on the whole surfaces of thesubstantial display region 62 and the dummy region 63, extends onto thesubstrate 60 outside the dummy region 63, and is disposed to face thelight-emitting power source wiring lines 23 outside the dummy region 63,that is, outside the display pixel portion 61. In addition, an end ofthe cathode 26 is connected to the cathode wiring line 26 a formed inthe circuit portion 11. The cathode 26 makes a current flow in thelight-emitting layers 50 as electrodes opposite to the pixel electrodes51. This cathode 26 has a stacked structure of a reflecting layer 26 cand a cathode layer 26 b, which is made of, for example, a stacked bodyof lithium fluoride and calcium. In the cathode 26, only the reflectinglayer 26 c extends to the outside of the display pixel portion 61. Sincethe reflecting layer 26 c reflects the light emitted from thelight-emitting layers 50 toward the substrate 60, it is preferable thatthe reflecting layer 26 c is made of, for example, Al, Ag, Mg/Ag stackedbody, etc. Furthermore, an oxidation-preventing protective layer made ofSiO₂, SiN, etc. may be formed on the reflecting layer 26 c.

[0088] Furthermore, as shown in FIG. 4, the relay substrate 30 is fixedto an end of the substrate 60 using the aforementioned anisotropicconductive film 40. In addition, the data line driving circuit 33 a, thecathode power source circuit 33 b and the light-emitting power sourcecircuit 33 c shown in FIG. 3 are built in the semiconductor chip 33mounted on the relay substrate 30. A portion surrounded with a dottedline in FIG. 4 indicates a fixing portion of the display substrate 20and the relay substrate 30. FIG. 6 is a top view around of the fixingportion 65 shown in FIG. 4. In addition, the anisotropic conductive film40 and the relay substrate 30 are not shown in FIG. 6.

[0089] As shown in FIG. 6, the external connection terminals are formedin the fixing portion 65. As the external connection terminals, a firstexternal connection terminal having substantially the same width as theline width is provided for each wiring line with a narrow line width,and a plurality of second external connection terminals having thinnerwidth than the line width is provided for each wiring line with a wideline width. For example, for each of the control signal wiring lines 24a for the scanning line driving circuit with a narrow line width, thefirst external connection terminals 67, 68, 69 having substantially thesame width as the line width of the control signal wiring lines 24 a forthe scanning line driving circuit are provided. On the other hand, thesecond external connection terminals 66 a, 66 b, 66 c having thinnerwidth than the line width of the light-emitting power source wiring line24R are provided for the light-emitting power source wiring line 23Rwith a wide line width. Furthermore, the second external connectionterminals 70 with the same line width as the signal lines 22 areprovided for the signal lines 22 having thinner width than that of thecontrol signal wiring lines 24 a for the scanning line driving circuit.Furthermore, the numbers of the first external connection terminals andthe second external connection terminals are properly set up inaccordance with the line widths of wiring lines formed on the substrate60.

[0090] In this way, the numbers of the first external connectionterminals and the second external connection terminals are changed inaccordance with the line width of wiring line formed on the substrate 60in order to make the pressing condition be as equal as possible all overthe fixing portion 65. That is, as described in conjunction with FIG. 1and FIG. 2, the display substrate 10 and the relay substrate 20 arefixed by using the anisotropic conductive film 40, but if the fixingconditions (for example, a width of terminal, an adhering area, a statewhen the pressure is applied, etc) are different, the electricalresistance in the fixing portion 65 varies in accordance with positions.If the electrical resistance in the fixing portion 65 varies inaccordance with its positions, defects in display such as non-uniformityof display and deterioration of contrast occur. For this reason, in thefixing portion 65, by changing the number of external connectionterminals in accordance with the line widths of wiring lines formed onthe substrate 60, the pressing conditions are made as equal as possibleto each other. Furthermore, by providing a plurality of externalconnection terminals, the adhering area can be enlarged. That is, sincethe anisotropic conductive film can be disposed between the plurality ofexternal connection terminals. And thus firm adhesion can be obtained.

[0091] Next, a structure of the external connection terminals formed inthe fixing portion 65 is described in detail below. FIG. 7 is across-sectional view of the second external connection terminal 66 c andthe second external connection terminal 70 taken along plane B-B′ inFIG. 6, and FIG. 8 is an enlarged view of the external connectionterminal 70 in FIG. 7. As shown in FIG. 7 and FIG. 8, the baseprotective layer 281 is formed on the substrate 60, and a gateinsulating layer 71 having SiO₂ and/or SiN as a main component is formedon the base protective layer 281. This gate insulating layer 71 isformed to electrically insulate channel regions of the thin filmtransistors not shown from the gate electrodes. In addition, in thepresent specification, the “main component” means a component having thehighest content ratio.

[0092] The signal lines 22 and the light-emitting power source wiringlines 23R are formed on the gate insulating layer 71, and the secondinterlayer insulating layer 283 is formed on the signal lines 22 and thelight-emitting power source wiring lines 23R. In addition, thelight-emitting power source wiring lines 23 and the control signalwiring line 24 a for scanning line driving circuit are formed at thesame time as the scanning lines 21 shown in FIG. 3.

[0093] In the second interlayer insulating layer 283, a plurality ofcontact holes are formed in the upper positions of the signal lines 22and the light-emitting power source wiring lines 23R. In addition, theelectrodes 73 are formed on the second interlayer insulating layer 283above the light-emitting power source wiring lines 23R, and theelectrodes 74, 75 are formed on the second interlayer insulating layer283 above the signal lines 22.

[0094] Since these electrodes 73, 74, 75 are formed by using asputtering method or the like after forming the contact holes H, concaveportions B are formed in accordance with the quantity of metal materialdeposited in the contact holes H on the upper surfaces of the contactholes H. In this regard, through the contact holes H, the electricalcommunication between the light-emitting power source wiring lines 23Rcovered with the second interlayer insulating layer 283 and theelectrodes 74 formed on the second interlayer insulating layer 283 andthe electrical communication between the signal lines 22 covered withthe second interlayer insulating layers 283 and the electrodes 74, 75formed on the second interlayer insulating layer 283 are established.

[0095] Furthermore, in the side portions and in end portions of theelectrodes 73, 74, 75 formed on the second interlayer insulating layer283 and between the electrodes 73, 74, 75, the first interlayerinsulating layer 284 made of inorganic material such as SiN for thepurpose of electrical insulation is formed. Transparent electrodes 77made of ITO and the like are formed in the upper portions, in the sideportions and in the periphery portions of the electrodes 73, 74, 75, andprotective layers 78 made of SiO₂ are formed between the transparentelectrode 77 formed in the periphery portion of the electrodes 73, 74,75 and the second external connection terminals 66 c, 70, 70.Furthermore, the electrodes 73, 74, 75 are formed at the same time asthe gate lines shown in FIG. 3, and the transparent electrode 77 isformed out of ITO at the same time as the pixel electrodes (anodes). Atthat time, the material such as ITO is formed by using the sputteringmethod and the like.

[0096] Unlike this method, by applying a liquid material containing aconductive material by using the inkjet method, it is possible to form ametal layer on the uppermost surface of the external connectionterminals. Further, as shown in FIG. 9 and the like, since the externalconnection terminals comprise a plurality of conductive layers, thistechnique can be applied to at least one layer of the plurality ofconductive layers, not limited to the uppermost surface in theaforementioned example, and in addition, it is possible to form all thelayers by using the inkjet method.

[0097] In this example, a dispersion solution (a liquid state material)obtained by dispersing conductive particles in a dispersion medium isused as the liquid material for the conductive film formation, and it isnot important whether it is water based or oil based. The conductivefine particles used here are conductive polymer or superconductor fineparticles in addition to metal fine particles containing at least onekind among gold, silver, copper, palladium and nickel. These conductivefine particles may be used after coating the organic material and thelike on the surface thereof, in order to improve the dispersibility. Thecoating material for coating the surface of the conductive fineparticles may include an organic solvent such as xylene or toluene, andcitric acid and the like.

[0098] It is preferable that the diameter of the conductive fineparticles is 1 nm or more and 0.1 μm or less. Specifically, it is morepreferable that the particle diameter be 5 nm or more and 0.1 μm orless. If the particle diameter is more than 0.1 μm, nozzles of a liquiddroplet ejecting head may be blocked undesirably. On the other hand, ifthe particle diameter is less than 5 nm, the volume ratio of the coatingmaterial to the conductive particles becomes greater, and thus the ratioof organic material in the obtained film becomes too great.

[0099] It is preferable that a dispersion medium whose vapor pressure is0.001 mmHg or more and 200 mmHg or less (about 0.133 Pa or more and26600 Pa or less) at the room temperature is used as the dispersionmedium of the solution containing the conductive particles. If the vaporpressure is higher than 200 mmHg, the dispersion medium is vaporizedrapidly after ejected and thus it is difficult to form a good film. Inaddition, it is more preferable that the vapor pressure of thedispersion medium is 0.001 mmHg or more and 50 mmHg or less (about 0.133Pa or more and 6650 Pa or less). If the vapor pressure is more than 50mmHg, the blocking of nozzles due to a rapid dry can occur easily whenejecting the liquid droplets by using the inkjet method. On the otherhand, if the vapor pressure of the dispersion medium at the roomtemperature is less than 0.001 mmHg, the dispersion medium dries slowlyand can easily remain in the film. Thus, it is difficult to obtain agood conductive film after a heat/light treatment that is a subsequentprocess.

[0100] The dispersion medium is not specifically limited, only if it candisperse the aforementioned conductive fine particles and does not causeaggregation. For example, in addition to water, alcohols such asmethanol, ethanol, propanol, butanol, etc., hydrocarbon-based compoundssuch as n-heptane, n-octane, decane, toluene, xylene, cimen, durene,inden, dipentene, tetrahydronaphthalene, decahydronaphthalene,cyclohexylbenzene, etc., ether-based compounds such asethyleneglycoldimethylether, ethyleneglycoldiethylether,ethyleneglycolmethylethylether, diethyleneglycoldimethyletheer,diehyleneglycoldiethylether, diethyleneglycolmethylethylether,1,2-dimethoxyehtane, bis(2-methoxyethyl)ether, p-dioxane, and polarcompounds such as prophylene carbonate, γ-buthylolactone,N-methyl-2-pyrrolidone, dimethylformamide, dimethylsulphoxide,cyclohexanone can be exemplified as a dispersion medium. Among these, inview of dispersibility of fine particles, stability of dispersionsolution and facilitation of application to the inkjet method, it ispreferable that water, alcohols, hydrocarbon-based compounds andether-based compounds be used as the dispersion medium, and it is morepreferable that water or hydrocarbon-based compounds is used as thedispersion medium. These dispersion mediums may be used separately or ina mixture of two kinds or more.

[0101] It is preferable that the concentration of the dispersion solutewhen the conductive fine particles are dispersed in the dispersionmedium be 1 mass % or more and 80 mass % or less, and be adjusted inaccordance with the film thickness of a desired conductive film.Further, when the concentration exceeds 80 mass %, the aggregation isapt to occur which makes it difficult to obtain a uniform film.

[0102] It is preferable that the surface tension of the dispersionsolution of the conductive fine particles be within range of 0.02 N/m ormore and 0.07 N/m or less. When the surface tension in ejecting liquidby using the inkjet method is less than 0.02 N/m, since the wettabilityof the ink compositions to the nozzle surfaces increases, the flybending can easily occur. When the surface tension exceed 0.07 N/m,since the shape of meniscus at the front ends of the nozzles is notstable, it is difficult to control the quantity of ejection or theejection timing.

[0103] In order to control the surface tension, a small amount ofcontrol agent for surface tension such as fluorine-based, silicon-based,or non-ionic compound may be added to the dispersion solution within arange where the contact angle with the substrate is not largelydecreased. The non-ionic control agent for surface tension enhances thewettability of liquid to the substrate and improves a leveling propertyof film, thereby to help reduce or prevent fine unevenness fromoccurring in the film. The dispersion solution may contain organiccompounds such as alcohol, ether, ester or ketone, as needed.

[0104] It is preferable that the viscosity of the dispersion solution be1 mPa·s or more and 50 mPa·s or less. When the liquid material isejected as liquid droplets using the inkjet method, if the viscosity isless than 1 mPa·s, the periphery portion of nozzles can be easilycontaminated with flowing liquid, but if the viscosity is more than 50mPa·s, the frequency of blocking in the nozzle holes increase, so thatit is difficult to eject the liquid droplets smoothly.

[0105] Examples of using gold particles are described below.

[0106] To a gold particle dispersion solution (product name “PerfectGold” made by Vacuum Metallurgy Co.) in which gold particles having adiameter of 10 nm are dispersed in toluene, xylene is added to obtain aliquid having a viscosity of 3 cp. Then, the aforementioned liquid isapplied to regions (flat portions of terminals) formed between theconvex portions using the inkjet method. Then, a metal thin film made ofgold is formed on the flat portions of terminal portions and at leastthe flat surfaces portions of the convex portions.

[0107] As an inkjet apparatus (may be referred to as a liquid applyingapparatus) used in the inkjet method, the apparatus, for example, shownin FIG. 14 can be used.

[0108] The inkjet apparatus comprises an inkjet head group 1, an X axialdriving shaft 4, a Y axial guide shaft 5, a control unit 6, a mountingsupport 7, a cleaning mechanism 8, a base 9, and a heater 15.

[0109] The inkjet head group comprises heads as inkjet applying means toeject a liquid containing predetermined conductive fine particles fromthe nozzles (ejecting side) and to apply it to a substrate at apredetermined interval. In the head group, a plurality of heads having aplurality of nozzles are formed. This head group in which the pluralityof heads are arranged is constructed in the layout as shown in FIG. 15.That is, the respective heads are arranged to be inclined with respectto the scanning direction of the heads.

[0110] As shown in the drawing, a plurality of inkjet heads are providedin the inkjet apparatus. The plurality of inkjet heads are arranged tobe inclined in the direction with which the scanning direction isintersected, and then the drawing using the inkjet can be executed. Forexample, by inclining the inkjet heads at 30° with respect to thescanning direction, the drawing by the inkjet apparatus is possible. Byinclining the inkjet heads in the direction with which the scanningdirection is intersected, the following advantages are obtained. Thatis, when a pattern gap is narrow, by inclining the heads, the nozzle gapis made visually narrow. In this regard, it is possible to execute thedrawing of narrow pitch pattern, and by varying the inclining angle, anypattern can be formed. In addition, in this case, the inkjet apparatushas a function in which the inkjet heads can be varied and adjusted atdesired angles.

[0111] The inkjet heads and units are described in detail below.

[0112] [Constitution of Head Unit]

[0113] The constitution of the head unit 420 is explained below. FIG. 15is a plan view illustrating a head unit provided in the liquid dropletejection processing apparatus. FIG. 26 is a side view illustrating thehead unit. FIG. 27 is a front view illustrating the head unit. FIG. 28is a cross-sectional view illustrating the head unit.

[0114] The head unit 420 has, as shown in FIG. 15 to FIG. 28, a headmain body 430 and an ink supply unit 431. Further, the head main body430 has a flat plate shaped carriage 426 and a plurality of headers 433having substantially the same shapes and provided in the carriage 426.

[0115] (Constitution of Headers)

[0116]FIG. 29 is an exploded perspective view illustrating the headers433 disposed in the head unit 420.

[0117] The headers 433 each have a printed board 435 of a strip shape,as shown in FIG. 29. In this printed board 435, various electrical parts436 are mounted and electrical wiring lines (not shown) are provided.Further, a window portion 437 is formed to penetrate the printed board435, at its longitudinal end side (a right side in FIG. 6). Furthermore,in the printed board 435, flow passages 438 through which ink 13 as afilter element material can flow are provided at both sides of thewindow portion 437.

[0118] In addition, an inkjet head 421 is integrally attached to onesurface side (lower surface side in FIG. 29) of the printed board 435 byusing a attaching member 440, substantially at its longitudinal one endside (right side in FIG. 29). This inkjet head 421 is formed in alongitudinal rectangular shape and attached in a state in which thelongitudinal direction thereof is arranged along the longitudinaldirection of the printed board 435.

[0119] In addition, it is preferable that the respective inkjet heads421 in the respective headers 433 have substantially the same shape,that is, for example, they may be predetermined standard products of apredetermined quality. Specifically, it is preferable that each inkjethead 421 has the same number of nozzles which will be described laterand the nozzle formation positions be equal each other, because it isefficient when assembling the inkjet heads 421 in the carriage 426 andit enhances the assembling accuracy. Further, when using products madethrough the same manufacturing/assembling processes, it is not necessaryto make specific products, so that it is possible to reduce cost.

[0120] Furthermore, connectors 441, which is electrically connected tothe inkjet head 421 through the electric wiring line 442, is integrallyattached to the other surface side (upper surface side in FIG. 29) ofthe printed board 435, substantially at the other longitudinal end side(left side in FIG. 29). Electrical wiring lines 442 (including powersource wiring lines and signal wiring lines) wiring lined to a vicescanning driver 427 are connected to the connectors 441 so as not toaffect the movement of the head unit 420. The electrical wiring lines442 connect a control device (not shown) to the head unit 420. That is,the electrical wiring lines 442 as schematically shown by the arrow ofchain double-dashed line in FIG. 15 and FIG. 28 are wired from the vicescanning driver 427 to the peripheral edge of the head unit 420, whichis at both sides of the arrangement direction of two rows of the headers433 in the head unit 420. The electrical wiring lines 442 are thenconnected to the connector 441, and thus do not cause the electricalnoises.

[0121] Furthermore, an ink introduction unit 443 is attached to theother surface side (upper surface side in FIG. 29) of the printed board435 substantially at longitudinal one end side (right side in FIG. 29),corresponding to the inkjet head 421. This ink introduction unit 443 hasa positioning tube portion 445 of an approximate cylindrical shape intowhich a positioning pin 444 provided in the attaching member 440 andpenetrating the printed board 435 is inserted, and a fixing claw 446 forfixing the ink introduction unit 443 to the printed board 435.

[0122] Furthermore, a pair of connecting portions 448 havingsubstantially a cylindrical shape tapered toward its tip are projectedfrom the ink introduction unit 443. These connecting portions 448 eachhave an opening (not shown) at the base end portion which would bedirected toward the printed board 435, the opening communicating insubstantially a liquid-tight manner with the flow passage 438 of theprinted board 435, and an opening (not shown) at the front end portionthrough which the filter element material 13 is capable of flowing.

[0123] Furthermore, as shown in FIG. 26 to FIG. 29, seal connectingportions 450 are attached to these connection portions 448, at thepointed end side thereof. The cylindrical inner sides of these sealconnecting portions 450 are formed substantially in a cylindrical shapesuch that the connecting portions 448 are fitted thereinto in aliquid-tight manner, and seal members 449 are formed at the front endportions thereof.

[0124] The structure of the main body is explained below.

[0125] The mounting support 7 mounts a substrate 101 to which the liquiddroplets (liquid) are applied by using the applicator, and includes amechanism to fix the substrate 101 to a reference position.

[0126] An X axial driving motor 2 is connected to the X axial drivingshaft 4. The X axial driving motor 2 includes a stepping motor, etc.,and if an X axial driving signal is supplied from the control unit 6,the X axial driving motor 2 rotates the X axial driving shaft 4. Whenthe X axial driving shaft 4 is rotated, the inkjet head group 1 moves inthe X axial direction.

[0127] The Y axial guide shaft 5 is fixed not to move with respect tothe base 9. The mounting support 7 includes a Y axial driving motor 3.The Y axial driving motor 3 includes a stepping motor, etc., and if theY directional driving signals are supplied from the control unit 6, theY axial driving motor 3 causes the mounting support 7 to move in the Ydirection.

[0128] The control circuit 6 supplies voltage to control the ejection ofliquid droplets, to the respective heads of the inkjet head group 1. Inaddition, the control unit 6 supplies driving pulse signals forcontrolling the X axial movement of the inkjet head group 1, to the Xaxial driving motor 2 and supplies driving pulse signals for controllingthe Y axial movement of the mounting support 7, to the Y axial drivingmotor 3.

[0129] The cleaning mechanism 8 includes a mechanism to clean the inkjethead group 1. In the cleaning mechanism 8, a Y axial driving motor (notshown) is provided. By driving this Y axial driving motor, the cleaningmechanism 8 moves along the Y axial guide shaft 5. The movement of thecleaning mechanism 8 is also controlled by the control unit 6.

[0130] The heater 15 herein heats the substrate 101 by lamp annealing,and carries out vaporization and drying of liquid applied to thesubstrate to convert it into a conductive film. The powerinput/interruption of the heater is also controlled by the controlcircuit 6. Furthermore, the heat treatment may be carried out by using ahot plate or by using a dry furnace, instead of the heater.

[0131] In this inkjet apparatus, pre-ejection and flushing are requiredfor the drawing by the inkjet apparatus.

[0132] When forming the external connection terminals as wiring linepatterns, the pre-ejection is previously carried out to the outside ofthe substrate. This prevents blocking of nozzles and ejecting apredetermined quantity of liquid droplets. The quantity of liquiddroplets pre-ejected is about 200 to 5000 drops and is ejected from thewhole nozzles formed in the inkjet head. Furthermore, the flushing is toeject the liquid droplets from the whole nozzles to ensure the stabilityof ejection. The quantity of ejection can be set properly, but it ispreferable that the same quantity as that in the pre-ejection beejected.

[0133] The liquid droplets ejected by the inkjet head are ejected in theorder, for example, as shown in FIG. 16 to FIG. 23. The method offorming the external connection terminals according to the presentinvention is described with reference to the drawings below. FIG. 16 isa flowchart illustrating an exemplary embodiment of the patternformation method according to the present invention.

[0134] In this exemplary embodiment, a case where the conductive filmpatterns are formed on the substrate will be exemplified.

[0135] In FIG. 16, a pattern formation method according to the presentembodiment comprises a step (step S1) of cleaning a substrate on whichthe droplets of liquid material are applied by using a predeterminedsolvent and the like, a lyophobic processing step (step S2) ofconstituting a part of surface treatment step on the substrate, alyophobic-property decreasing step (step S3) of constituting a part ofthe surface treatment step for adjusting the lyophobic property of thesubstrate surface on which the lyophobic process is carried out, amaterial arrangement step (step S4) of arranging on the surface-treatedsubstrate the droplets of the liquid material containing a material forforming conductive film wiring lines by the liquid droplet ejectionmethod to form (draw) a film pattern, an intermediate drying step (stepS5) of removing at least a part of the solvent components of the liquidmaterial arranged on the substrate and including heat/light treatment,and a baking step (step S7) of baking the substrate on which apredetermined film pattern is formed. In addition, after theintermediate drying step, it is determined whether a predeterminedpattern drawing has been completed or not (step S6). If the patternformation has been completed, the baking process is carried out. On theother hand, if the pattern drawing has not been completed, the materialarrangement step is carried out.

[0136] Next, the material arrangement step (step S4) by the liquiddroplet ejection method which is a characteristic of the presentinvention is described with reference to FIG. 17(a) to FIG. 23.

[0137] The material arrangement step of the present exemplary embodimentis a process for forming on the substrate the external connectionterminals which are the film patterns (the wiring line patterns) W in aline shape, by ejecting the droplets of the liquid material containingthe material for forming the conductive wiring lines from the liquiddroplet ejecting head onto the substrate. The liquid material is aliquid state substance obtained by dispersing in a dispersion mediumconductive particles such as metal which is the material to form theconductive film wiring lines.

[0138] In FIG. 16, the material arrangement step (step S4) is forejecting droplets of the liquid material from the ejecting nozzles 10Aof the liquid droplet ejection heads 10 (the aforementioned head group)in the liquid droplet ejection apparatus to arrange the droplets on thesubstrate 11, and includes a first step (see FIG. 17(a)) of formingwidthwise central portion (central pattern) W1 of the film pattern W onthe substrate 11, a second step (see FIG. 17(b)) of forming one sideportion (a first side pattern) W2 on one side of the central pattern W1formed on the substrate 11, and a third step (see FIG. 17(c)) of formingthe other side portion (a second side pattern) W3 on the other side ofthe central pattern W1 formed on the substrate 11. By the first, secondand third steps, the film pattern W in a line shape are formed as shownin FIG. 17(c).

[0139] In the first step, as shown in FIG. 17(a), the liquid droplets ofthe liquid material are ejected from the liquid droplet ejection head 10and arranged at a constant space (pitch) on the substrate 11. Further,by repeating the liquid droplet arrangement process, the central patternW1 in a line shape constituting a part of the film pattern W is formedat the central portion of a formation region W4 of the film pattern W onthe substrate 11. Furthermore, since the surface of the substrate 11 ispreviously processed to have a desired lyophobic property in step S2 andstep S3, diffusion of the liquid droplets arranged on the substrate 11is suppressed. For this reason, it is possible to surely control thepattern shape in a good state and it is easy to obtain a thick film.

[0140] Here, after arranging the liquid droplets to form the centralpattern W1 on the substrate 11, the intermediate drying step (step S5)is carried out as needed in order to carry out the removal of thedispersion medium. The intermediate drying step may be a light treatmentusing lamp annealing, in addition to a general heat treatment using aheating apparatus such as a hot plate, an electric furnace or a hot airgenerator.

[0141] Next, in the second step, as shown in FIG. 17(b), the liquiddroplets of the liquid material are ejected from the liquid dropletejection head 10, and as a result, the first side pattern W2 in a lineshape adjacent to one side of the central pattern W1 is formed. Here,the liquid droplet ejection head 10 ejects the liquid droplets tosuperpose the ejected liquid droplets with at least a part of thecentral pattern W1 formed on the substrate 11 when the first sidepattern W2 is formed. In this regard, the liquid droplets constitutingthe central pattern W1 and the first side pattern W2 are surelyconnected to each other and discontinuous portions of the material forforming the conductive film wiring line are not generated in the formedfilm pattern W.

[0142] Also, in the second step, the liquid droplets are arranged at aconstant pitch on the substrate 11, and by repeating this arrangementprocess, the first side pattern W2 constituting a part of the filmpattern W is formed at one side of the formation region W4 of the filmpattern W. Accordingly, the central pattern W1 and the first sidepattern W are integrated.

[0143] Here, after arranging liquid droplets for forming the first sidepattern W2 on the substrate 11, the intermediate drying step (step S5)is carried out as needed in order to carry out the removal of thedispersion medium.

[0144] Next, in the third step, as shown in FIG. 17(c), liquid dropletsof the liquid material are ejected from the liquid droplet ejection head10, and as a result, the second side pattern W3 in a line shape adjacentto the other side of the central pattern W1 is formed. Here, the liquiddroplet ejection head 10 ejects the liquid droplets to superpose theejected liquid droplets with at least a part of the central pattern W1formed on the substrate 11 when the second side pattern W3 is formed. Inthis regard, the liquid droplets constituting the central pattern W1 andthe second side pattern W3 are surely connected to each other, anddiscontinuous portions of the material to form the conductive filmwiring lines are not generated in the formed film pattern W. As aresult, the central pattern W1 and the second side pattern W3 areintegrated, and thus three patterns W1, W2, W3 in a line shape areintegrated, thereby to form the film pattern W with a wide width. Inaddition, in the third step, the liquid droplets are arranged at aconstant pitch, and by repeating this arrangement process, the secondside pattern W3 constituting a part of the film pattern W is formed atthe other side of the formation region W4 of the film pattern W.

[0145] At that time, by adjusting the position (the distance from thecentral pattern W1) where the liquid droplets are ejected in the second,and the third steps, it is possible to control the final line width ofthe film pattern W in a line shape. Further, by varying heights (thethicknesses) of the plurality of patterns W1, W2, and W3 formed in eachof the first, second and third steps from the surface of the substrate11, it is possible to control the film thickness of the film pattern Wafter integrated.

[0146] Furthermore, when unevenness is formed in a profile of pattern,it is preferable that fine liquid droplets be applied as needed to fillthe unevenness. These fine liquid droplets are smaller in size thanthose normally applied (indicating the liquid droplets applied into W1,W2, W3), and its quantity of ejection is set to be smaller than that ofthe normal liquid droplets. Like this, by applying fine liquid droplets,it is possible to form a straight line shaped pattern without unevennessin the profile thereof.

[0147] Next, with reference to FIG. 18(a) to FIG. 18(c), the procedurein which the central pattern W1 and the side patterns W2, W3 in a lineshape are formed will be described.

[0148] First, as shown in FIG. 18(a), the liquid droplets L1 ejectedfrom the liquid droplet ejection head 10 are arranged sequentially witha predetermined pitch on the substrate 11. That is, the liquid dropletejection head 10 arranges the liquid droplets L1 not to overlap eachother on the substrate 11 (first arrangement step). In this example, thearrangement pitch P1 of the liquid droplets L1 is set larger than thediameter of the liquid droplets L1 right after the arrangement on thesubstrate 11. This allows the liquid droplets L1 right after thearrangement on the substrate 11 not to overlap each other (not tocontact each other), and thus integration and diffusion of the liquiddroplets L1 on the substrate 11 to be prevented. In addition, thearrangement pitch P1 of the liquid droplets L1 is set to be equal to orsmaller than two times of the diameter of the liquid droplets L1 rightafter the arrangement on the substrate 11.

[0149] Here, after arranging the liquid droplets L1 on the substrate 11,the intermediate drying step (step S5) can be carried out as needed inorder to carry out the removal of the dispersion medium. Theintermediate drying step may be a light treatment using lamp annealing,in addition to a general heat treatment using a heating apparatus suchas a hot plate, an electric furnace and a hot air generator, asdescribed above. In this case, the degree of heating or lightirradiation may be increased such that the conversion of the dispersionsolution into a conductive film occurs as well as the removal of thedispersion medium, but it is sufficient if the dispersion medium isremoved to some extent.

[0150] Next, as shown in FIG. 18(b), the aforementioned arrangementsteps of the liquid droplets are repeated. That is, similarly in FIG.18(a), the liquid material is ejected as liquid droplets L2 from theliquid droplet ejection head 10 and the liquid droplets L2 are arrangedat a constant pitch on the substrate 11.

[0151] At that time, the volume (the quantity of liquid material per oneliquid droplet) of the liquid droplet L2 and the arrangement pitch P2are the same as those of the previous liquid droplets L1. In addition,the arrangement positions of the liquid droplets L2 are shifted by ½pitch from those of the liquid droplets L1, and the liquid droplets L2in this turn are arranged at the intermediate positions between theliquid droplets L1 previously arranged on the substrate 11 (secondarrangement step). As shown in the drawing, by applying the secondliquid droplets L2 to complement the spaces between the first liquiddroplets L1 which were applied first, it is possible to form wiring linepattern (here, the external connection wiring lines) with excellentplanarity.

[0152] As described above, the arrangement pitch P1 of the liquiddroplets L1 on the substrate 11 is larger than the diameter of theliquid droplets L1 right after the arrangement on the substrate 11 andequal or smaller than two times of the diameter thereof. For thisreason, since the liquid droplets L2 are arranged at the intermediatepositions between the liquid droplets L1, a part of the liquid dropletsL2 overlap the liquid droplets L1 and the spaces between the liquiddroplets L1 are filled. At that time, the liquid droplets L2 of thistime contact the liquid droplets L1 of the last time, but since thedispersion medium of the liquid droplets L1 of the last time ispreviously removed completely or to some extent, integration of the bothand diffusion on the substrate 11 hardly occur.

[0153] Furthermore, in FIG. 18(b), although the position from which thearrangement of the liquid droplets L2 is started is the same side (theleft side in FIG. 18(a)) as in the last time, it may be started from theopposite side (the right side). By carrying out the ejection of liquiddroplets when moving them in each direction during reciprocation, it ispossible to reduce the relative moving distance between the liquiddroplet ejection head 10 and the substrate 11.

[0154] After arranging the liquid droplets L2 on the substrate 11, theintermediate drying step can be carried out as needed in order to carryout the removal of the dispersion medium, similar to the last time.

[0155] By repeating a series of arrangement steps of the liquid dropletsa plurality of times, the spaces between the liquid droplets arranged onthe substrate 11 are filled, and as shown in FIG. 18(c), the centralpattern W1 and the side patterns W2, W3 constituting a continuouspattern in a line shape are formed on the substrate 11. In this case, byincreasing repeating times of the liquid droplet arrangement step, theliquid droplets sequentially overlap on the substrate 11. The filmthickness of the patterns W1, W2, W3, that is, the height (thickness)from the surface of the substrate 11 increases. The height (thickness)of the line shaped patterns W1, W2, W3 is set in accordance with adesired film thickness required for the final film pattern, andrepeating times of the liquid droplet arrangement process are set inaccordance with the set film thickness.

[0156] Furthermore, the line shaped pattern formation method is notlimited to the method shown in FIG. 18(a) to FIG. 18(c). For example,arrangement pitch of the liquid droplets or the quantity of shift inrepeating may be set arbitrarily, and arrangement pitch of the liquiddroplets on the substrate P when the patterns W1, W2, W3 are formed maybe set to values different from each other. For example, when the pitchof the liquid droplets in forming the central pattern W1 is P1, thepitch of the liquid droplets in forming the side patterns W2, W3 may beset wider (for example, P1×2) than P1. Of course, the pitch may benarrower (for example, P1×0.5) than P1. In addition, the volume of theliquid droplet in forming the patterns W1, W2, W3 may be set to havevalues different from each other. Alternatively, the arrangementatmosphere (temperature, humidity, etc.) of liquid droplets, theatmosphere where the substrate 11 or the liquid droplet ejection head 10is disposed, that is, the environmental conditions to arrange material,may be set differently in each of the first, second and third steps.

[0157] Furthermore, in the present exemplary embodiment, although theplurality of side patterns W2, W3 are formed one by one, two may beformed at the same time. Here, compared the case that the plurality ofpatterns W2, W3 are formed one by one with the case that two are formedat the same time, since total number of the drying step may bedifferent, it is preferable that the drying condition be set not todamage the lyophobic property of the substrate 11.

[0158] Furthermore, in the present exemplary embodiment, although onecentral pattern W1 is formed in the first step, two or more centralpatterns W1 may be formed. In addition, by ejecting the liquid dropletsto both sides of the plurality of central patterns W1 to make themcontinuous, it is possible to easily form the film pattern having awider line width.

[0159] Furthermore, although the liquid droplets can be applied usingany one of the nozzles, the liquid droplets may be applied using othernozzles in order to reduce or suppress deviation in the quantity ofejection of the liquid droplets between nozzles. For example, it ispreferable that a first nozzle be used for the application of the liquiddroplets L1 and a second nozzle different from the first nozzle be usedfor the application of the liquid droplets L2 complementing the spacesbetween the liquid droplets L1. Furthermore, although the first nozzleand the second nozzle may be provided in the same head, since aplurality of heads are formed as described above, the nozzles may beformed in different heads, respectively. That is, the first nozzle maybe formed in a first head, the second nozzle may be formed in a secondhead. Accordingly, when forming a desired pattern, the application maybe carried out using the first nozzle and the second nozzle.

[0160] Next, with reference to FIG. 19(a) to FIG. 22(a), an example ofthe procedure in which the liquid droplets are ejected on the substrateis described below. As shown in these drawings, there is provided on thesubstrate 11 a lattice-shaped bit map having pixels of a plurality ofunit regions on which the liquid droplets of liquid material arearranged. The liquid droplet ejection head 10 ejects liquid dropletstoward pixel positions set in the bit map. Here, one pixel is set to asquare shape. In addition, it is assumed that the liquid dropletejection head 10 ejects the liquid droplets from the ejection nozzle 10Awhile scanning the substrate 11 in the Y axial direction. In thedescription with reference to FIG. 19 to FIG. 22, “1” is given to theliquid droplets ejected during a first scanning, and “2”, “3”, . . . and“n” are given to the liquid droplets ejected during a second scanning, athird scanning, . . . and an n-th scanning, respectively. Furthermore,in the following description, the liquid droplets are ejected to each ofthe regions (pattern formation region) indicated by a gray color in FIG.19 to form the film pattern W.

[0161] As shown in FIG. 19(a), in the first scanning, the liquiddroplets are ejected at one pixel interval in the central patternformation region in order to form the central pattern W1. Here, theliquid droplets ejected to the substrate 11 are landed on the substrate11 and then are diffused on the substrate 11. That is, as indicated bycircles in FIG. 19(a), the liquid droplets landed on the substrate 11are diffused to each have a diameter c larger than the size of onepixel. Here, since the liquid droplets are ejected at a predeterminedinterval (one pixel) in the Y axial direction, the liquid dropletsarranged on the substrate 11 are set not to overlap each other. In thisregard, it is possible to prevent the liquid material from beingexcessively provided on the substrate 11 in the Y axial direction and itis also possible to reduce or prevent generation of bulge.

[0162] Furthermore, in FIG. 19(a), although the liquid droplets whenejected to the substrate 11 are arranged not to overlap each other, theliquid droplets may be arranged to slightly overlap each other. Inaddition, although the droplets are ejected at one pixel interval, theliquid droplets may be ejected at any number, i.e. two or more, of pixelinterval. In this case, it is possible that the space between the liquiddroplets on the substrate is complemented by increasing the numbers ofthe scanning operation and the ejecting operation of the liquid dropletejection head 10 on the substrate 11.

[0163]FIG. 19(b) is a schematic when the liquid droplets are ejected tothe substrate 11 from the ejection nozzle 10A of the liquid dropletejection head 10 in the second scanning. In addition, in FIG. 19(b), “2”is given to the liquid droplets ejected in the second scanning. In thesecond scanning, the liquid droplets are ejected to complement thespaces between the liquid droplets “1” ejected during the firstscanning.

[0164] Thus, the central pattern W1 is formed to be continuous betweenthe liquid droplets by the first and second scanning and ejectingoperations.

[0165] Next, the liquid droplet ejection head 10 and the substrate 11are relatively shifted in the X axial direction by a size of one pixel.Here, the liquid droplet ejection head 10 is step-shifted in the −Xdirection with respect to the substrate 11 by the size of one pixel.Then, the liquid droplet ejection head 10 carries out the thirdscanning. In this regard, as shown in FIG. 20(a), the liquid droplets“3” for forming the first side pattern W2 are arranged on the substrate11 so as to be adjacent to the −X side of the central pattern W1. Here,the liquid droplets “3” are arranged at one pixel interval in the Yaxial direction. Here, the liquid droplets “3” in the first scanning(that is, the third scanning in total) after the step-shift of theliquid droplet ejection head 10 in the X axial direction are arranged atpositions adjacent to the liquid droplets “1” in the first scanningbefore the step-shift to the X axis.

[0166]FIG. 20(b) is a schematic when the liquid droplets are ejected tothe substrate 11 from the liquid droplet ejection head 10 in the fourthscanning. In FIG. 20(b), “4” is given to the liquid droplets ejected inthe fourth scanning. In the fourth scanning, the liquid droplets areejected to complement the spaces between the liquid droplets “3” ejectedin the third scanning. Then, the first side pattern W2 is formed to becontinuous between the liquid droplets by the third and fourth scanningand ejecting operations. Here, the liquid droplets “4” in the secondscanning (that is, the fourth scanning in total) after the step-shiftare arranged at positions adjacent to the liquid droplets “2” in thesecond scanning before the step-shift with respect to the X axis.

[0167] Next, the liquid droplet ejection head 10 and the substrate 11are relatively shifted in the X axial direction by the size of twopixels. Here, the liquid droplet ejection head 10 is step-shifted by thesize of two pixels in the +X direction with respect to the substrate.Then, the liquid droplet ejection head 10 carries out the fifthscanning. In this regard, as shown in FIG. 21(a), the liquid droplets“5” for forming the second side pattern W3 are arranged on the substrateto be adjacent to the central pattern W1 on its +X side. Here, theliquid droplets “5” are arranged at one pixel interval in the Y axialdirection. Here, the liquid droplets “5” ejected in the fifth scanning,after the step-shift of the liquid droplet ejection head 10 in the Xaxial direction, are arranged at positions adjacent to the liquiddroplets “1” with respect to the X axis.

[0168]FIG. 21(b) is a schematic when the liquid droplets are ejected tothe substrate 11 from the liquid droplet ejection head 10 in the sixthscanning. In FIG. 21(b), “6” is given to the liquid droplets ejected inthe sixth scanning. In the sixth scanning, the liquid droplets areejected to complement the space between the liquid droplets “5” ejectedin the third scanning. Then, the second side pattern W3 is formed to becontinuous between the liquid droplets by the fifth and sixth scanningand ejecting operations. Here, the liquid droplets “6” in the sixthscanning are arranged at positions adjacent to the liquid droplets “2”with respect to the X axis.

[0169] Like this, although the same nozzle can be used to eject liquiddroplets for one pattern, a nozzle different from that may be used asdescribed above. The ejection method when using different nozzles toeject liquid droplets is the same as described above. In addition, suchutilization of nozzle can be similarly applied to examples which aredescribed below.

[0170]FIG. 22(a) is a schematic illustrating an example in which theliquid droplets are ejected and arranged in different procedures. InFIG. 22(a), at positions adjacent to the −X side of the liquid droplets“1” for forming the central pattern W1 with respect to the X axis, theliquid droplets “4” ejected in the second scanning (the fourth scanningin total) after the step shift in the X axial direction of the liquiddroplet ejection head 10 are arranged, while at positions adjacent tothe −X side of the liquid droplets “2” for forming the central patternW1 with respect to the X axis, the liquid droplets “3” ejected in thefirst scanning (the third scanning in total) after the step shift in theX axial direction of the liquid droplet ejection head 10 are arranged.Similarly, at positions adjacent to the +X side of the liquid droplets“1” with respect to the X axis, the liquid droplets “6” ejected in thesixth scanning in total are arranged, while at positions adjacent to the+X side of the liquid droplets “2” for forming the central pattern W1with respect to the X axis, the liquid droplets “5” ejected in the fifthscanning in total are arranged. Like this, when forming the respectivelines W1, W2, W3, the procedure of ejected positions of the liquiddroplets may be set to be different for every line.

[0171] Furthermore, as in the example shown in FIG. 23, the proceduremay be set such that the liquid droplets “1” to form the central patternW1 are arranged, the liquid droplet ejection head 10 is thenstep-shifted, the liquid droplets “2” for forming the first side patternW2 are then arranged, the liquid droplet ejection head 10 is thenstep-shifted, and then the liquid droplets “3” to form the second sidepattern W2 are arranged. In addition, the liquid droplets “4”, “5”, “6”are sequentially ejected to complement them. Like this, when forming theside patterns W2, W3 after forming the central pattern W1, the formationof the side patterns W2, W3 may start from a state when the formation ofthe central pattern W1 is not completed, instead after the formation ofthe central pattern W1 is completed.

[0172]FIG. 24(a) and FIG. 24(b) are schematics illustrating an exampleof the arrangement of liquid droplets for formation of the first andsecond side patterns W2, W3 on both sides of the central pattern W1 inthe second and third steps. In the example of FIG. 24(a), the centralpattern W1 is formed under the same conditions as the ejectingconditions (the arranging conditions) described referring to FIG. 18. Onthe other hand, the ejecting conditions (the arranging conditions) inthe second and third steps are different from the ejecting conditions toform the central pattern W1. Specifically, the volume of liquid dropletsLn is set greater than that in the first step. That is, the quantity ofliquid material ejected at once is increased. Incidentally, in thisexample, the arrangement pitch of the liquid droplets Ln is the same asin the first step. By increasing the volume of the liquid droplets Ln,it is possible to shorten the total time to form the film pattern W andthus to accomplish an enhancement in throughput. Furthermore, since theincreased volume of the liquid droplets is apt to cause the bulge, thevolume condition of liquid droplets under which the bulge is notrendered is previously obtained in accordance with the materialcharacteristics of the liquid material, and then the maximum possiblevolume of liquid droplets to be ejected may be set based on the obtainedcondition.

[0173] In the example of FIG. 24(b), in the ejecting conditions of thesecond and third steps, the arrangement pitch of the liquid droplets Lnis narrower than that of the first step. In addition, the volume of theliquid droplets Ln may be the same or larger than that in the firststep, as shown in FIG. 24(a). By narrowing the arrangement pitch ofliquid droplets, the quantity of liquid droplets to be arranged per unitarea increases, so that the pattern can be formed in a shorter time.

[0174] Like above, various ejection methods are described, but a methodof ejecting liquid droplets by using different nozzles is furtherdescribed below.

[0175] When forming one pattern (here, one line), it can be formed byusing a plurality of nozzles. For example, it is possible that theliquid droplets of the first time are applied by using a first nozzleand the liquid droplets of the second time are applied by using a secondnozzle different from the first nozzle. In addition, the liquid dropletsof the third time may be applied by using a third nozzle and the liquiddroplets of the fourth time by using a fourth nozzle. By using such anapplication method, when there is non-uniformity in quantity of ejectiondue to the nozzles, the non-uniformity thereof can be reduced orsuppressed to the minimum. That is, when the application is executed byusing the same nozzle, the total quantity of ejection of the liquiddroplets varies. As a result, the difference in film thickness and thedifference in resistance value in the electrodes are influenced.Therefore, in order to address or solve such problems, by applyingliquid droplets by using different nozzles for one electrode (or onepattern), it is possible to suppress the difference in film thickness tothe minimum, and it is also possible to make the resistance of electrodesubstantially uniform.

[0176] <Surface Treatment Step>

[0177] Next, the surface treatment steps S2, S3 shown in FIG. 16 isdescribed below. In the surface treatment step, the surface of asubstrate on which a conductive film wiring line (external connectionterminals) is formed is processed to be lyophobic to a liquid material(step S2).

[0178] Specifically, the surface treatment is carried out on thesubstrate such that a predetermined contact angle with respect to liquidmaterial containing conductive particles is 60° or more, and preferably90° or more and 110° or less. The method of controlling lyophobicproperty (wettability) can include, for example, a method of formingself-organization film, a plasma treatment method, a UV irradiationmethod, etc.

[0179] In the self-organization-film formation method, aself-organization film made of an organic molecular film, etc. is formedon a surface of the substrate on which a conductive film wiring line isformed. The organic molecular film to treat the substrate surfacecomprises a functional group capable of binding to the substrate, afunctional group, such as the lyophilic radical or the lyophobic radicalon an opposite side thereof for reforming the surface property(controlling the surface energy) of the substrate, and straight chain ofcarbons or partially branched chain of carbons for connecting thefunctional groups to each other. Therefore, the organic molecular filmis coupled to the substrate and self-organized to form a molecular film,for example, a monomolecular film.

[0180] Here, the self-organization film includes a coupling functionalgroup capable of reacting with the constituent atoms of the underlyinglayer, etc. of the base layer of the substrate and other straight chainmolecules. The self-organization film is a film formed by orientingcompounds having very high orientation property due to the interactionbetween the straight molecules. Since the self-organization film isformed by orienting mono-molecules, the film thickness can be very thinand a uniform film at a molecule level is obtained. That is, since thesame molecules are positioned on the surface of the film, it is possibleto give a uniform and excellent lyophobic property or lyophilic propertyto the surface of film.

[0181] By using, for example, fluoroalkylsilane as a compound having ahigh orientation property, the respective compounds are oriented suchthat the fluoroalkyl radical is positioned on the film surface to form aself-organization film and a uniform lyophobic property is given to thefilm surface.

[0182] Examples of the compound of forming the self-organization filminclude fluoroalkylsilane (hereinafter, referred to as “FAS”) such asheptadecafluoro-1,1,2,2tetrahydrodesiltriethoxysilane,heptadecafluoro-1,1,2,2tetrahydrodesiltrimethoxysilane,heptadecafluoro-1,1,2,2tetrahydrodesiltrichlorosilane,tridecafluoro-1,1,2,2tetrahydrooctyltriethoxysilane,tridecafluoro-1,1,2,2tetrahydrooctyltrimethoxysilane,tridecafluoro-1,1,2,2tetrahydrooctyltrichlorosilane,trifluoropropyltrimethoxysilane, etc. These compounds may be usedseparately or in combination of two or more thereof.

[0183] Furthermore, by using FAS, the close adherence to the substrateand the excellent lyophobic property can be obtained.

[0184] FAS is generally expressed in a structural formula RnSiX(4−n).Here, n indicates an integer of 1 or more and 3 or less, and X indicatesa hydrolytic radical, such as a methoxy radical, ethoxy radical, halogenatom, etc. In addition, R is a fluoroalkyl radical and has a structure(CF3)(CF2)x(CH2)y (here, x is an integer of 0 or more and 10 or less,and y is an integer of 0 or more and 4 or less), and when a plurality ofR or X are coupled to Si, all the R or X may be the same or differentfrom each other, respectively. The hydrolytic radical indicated by Xforms silanol through the hydrolysis and reacts with hydroxyl radical ofa base of the substrate (glass, silicon) to be coupled to the substratewith a siloxane bond. On the other hand, since R has fluoro radical,such as (CF3) at the surface thereof, it reforms the base surface of thesubstrate into a non-wettable surface having a low surface energy.

[0185] The self-organization film including the organic molecular film,etc. is formed on the substrate by putting the aforementioned rawmaterial compounds and the substrate in the same sealed vessel andleaving them alone at a room temperature for two or three days. Inaddition, by maintaining the whole sealed vessel at 100° C., theself-organization film is formed on the surface within about threehours. Although these are the methods to form the self-organization filmin a vapor phase, the self-organization film may be formed in a liquidphase. For example, by immersing the substrate in a solution containingraw material compounds, and then cleaning and drying the substrate, aself-organization film is formed on the substrate. Furthermore, beforethe formation of the self-organization film, by irradiating to thesurface of the substrate with UV light or by cleaning the substrate witha solvent, it is preferable that the pre-treatment be carried out on thesubstrate surface.

[0186] After carrying out the FAS treatment, the lyophobic-propertydecreasing step of providing the substrate with a desired lyophobicproperty is carried out as needed (step S3). That is, when the FAStreatment is carried out as the lyophobic process, the film pattern Wformed on the substrate may be easily peeled off from the substrate dueto excessively intensive lyophobic property. Therefore, the step ofdecreasing (adjusting) the lyophobic property is carried out. The stepof decreasing the lyophobic property can includes the UV ray irradiationprocessing with a wavelength of about 170 to 400 nm. By irradiating thesubstrate with UV ray of a predetermined power for a predetermined time,the lyophobic property of the substrate, on which the FAS treatment iscarried out, decreases, and as a result, the substrate has a desiredlyophobic property. Otherwise, by exposing the substrate to the ozoneatmosphere, the lyophobic property of the substrate can be controlled.

[0187] On the other hand, in the plasma treatment method, the plasmairradiation is carried out on the substrate at a normal pressure orunder vacuum. The kind of gas to be used for the plasma treatment can beselected variously in consideration of the surface material of thesubstrate on which a conductive film wiring line is formed. The processgas can include, for example, 4fluoromethane, perfluorohexane,perfluorodecane, etc.

[0188] A treatment of processing the substrate surface so as to belyophobic may be carried out by adhering a film having a desiredlyophobic property, for example, a polyimide film processed with4fluoroethylene, to the substrate surface. Alternatively, the polyimidefilm having a high lyophobic property may be used as a substrate as itis.

[0189] By carrying out such surface treatment on the surface on whichthe external connection terminals are formed, when liquid droplets areejected and applied thereto, it is possible to form a wiring patternhaving a good planarity and a small unevenness in a profile.Furthermore, when the electrodes 73, 74, 75 are formed, theaforementioned surface treatment is carried out on the interlayerinsulating layer 283. Alternatively, when electrodes are formed atpositions corresponding to the transparent electrode 77 by the inkjetmethod, by carrying out the surface treatment on the electrodes 73, 74,75 corresponding to the lower layer, electrodes (external connectionterminals) can be formed on the uppermost thereof by the inkjet method.

[0190] <Intermediate Drying Step>

[0191] Next, the intermediate drying step S5 shown in FIG. 16 isdescribed in detail below. In the intermediate drying step (heat/lighttreatment step), a dispersion medium or a coating material contained inthe liquid droplets ejected on the substrate is removed. That is, fromthe liquid material for the conductive film formation disposed on thesubstrate, it is necessary to remove the dispersion medium in order tofacilitate electrical contact between particles. In addition, when anycoating material such as an organic material and the like is coated onthe surface of the conductive fine particles in order to enhance thedispersibility, it is also necessary to remove the coating material.

[0192] Although the heat/light treatment is typically carried out in theatmosphere, it may be carried out in the atmosphere of inert gas, suchas nitrogen, argon, or helium, if necessary. The temperature of theheat/light treatment is appropriately determined in consideration of theboiling point (vapor pressure) of the dispersion medium, the types orpressure of the atmosphere gas, thermal behaviours of the particles suchas dispersibility or oxidizability, presence/absence or quantity of thecoating material, and heat resistant temperature of the base material.For example, in order to remove the coating material made of an organicmaterial, it is necessary to carry out baking at about 300° C. Inaddition, when a substrate made of plastic and the like is used, it ispreferable that the sintering be carried out at the room temperature ormore and 100° C. or less.

[0193] In the heat treatment, for example, a heating apparatus such as ahot plate or an electric furnace, may be used. In the light treatment,lamp annealing may be used. An infrared lamp, a xenon lamp, a YAG laser,an argon laser, a carbonic acid gas laser, an excimer laser using XeF,XeCl, XeBr, KrF, KrCl, ArF, ArCl, etc., may be used as a light source oflight used in the lamp annealing although it is not specifically limitedto them. Light sources having power output range between 10 W and 5000 Ware generally used, but in the present exemplary embodiment, lightsources have power output range between 100 W and 1000 W are sufficient.When the electrical contact between fine particles is surely establishedby the aforementioned heat/light treatment, the dispersion solution isconverted into a conductive film.

[0194] Furthermore, at that time, it is allowable to raise the degree ofthe heating or the light irradiation until the dispersion solution isconverted into a conductive film as well as the removal of thedispersion medium. However, since the conversion into the conductivefilm may be carried out in the heat treatment/light treatment step in abundle after the completion of the arrangement of all the liquidmaterials, it is sufficient to remove some portion of the dispersionmedium in this step. For example, in the heat treatment, it is allowableto carry out the heating at typically about 100° C. for several minutes.In addition, the dry treatment may proceed at the same time incombination with the ejection of liquid droplets. For example, thesubstrate is previously heated, or a dispersion medium having lowboiling point is used in combination with the cooling of the liquiddroplet ejection head, so that the drying of liquid droplets can beproceeded just after the arrangement of liquid droplets on thesubstrate.

[0195] As described above, there may be a case that the overheatingtreatment is carried out after the application. That is, the substrate101 on which the fine particle dispersion solution 21 is applied in apredetermined pattern is subjected to the heat treatment to remove asolvent and facilitate the electrical contact between the fineparticles. Although the heat treatment is typically carried out in theatmosphere, it may be carried out in the ambient of inert gas such asnitrogen, argon, helium, etc., if necessary. The temperature of theaforementioned heat treatment may be properly determined according tothe boiling point (vapor pressure) of the solvent, pressure, thermalbehaviours of the fine particles, and it is not specifically limited,however, it is preferably performed at the room temperature or more and300° C. or less. When a substrate made of plastic and the like is used,it is preferable that the treatment is carried out at the roomtemperature or more and 100° C. or less.

[0196] The heat treatment may be carried out with lamp annealing otherthan using a hot plate, an electric furnace, and the like. An infraredlamp, a xenon lamp, a YAG laser, an argon laser, a carbonic acid gaslaser, an excimer laser using XeF, XeCl, XeBr, KrF, KrCl, ArF, ArCl,etc., and the like may be used as a light source of light used in thelamp annealing, although it is not specifically limited to them. Lightsources having output power range between 10 W and 5000 W are generallyused, but in the present exemplary embodiment, it is sufficient for thelight sources to have output power range between 100 W and 1000 W.

[0197] As shown in FIG. 7 and FIG. 8, a plurality of concave portions Bare formed on the surfaces of the second external connection terminals66 c, 70, 70 provided in the electro-optical device according to thepresent embodiment, and the second external connection terminals 66 c,70, 70 are divided into a plurality of electrodes by the concaveportions. As shown in FIG. 6, although the uniformity of the fixingcondition at the fixing portions 65 is promoted by changing the numberof the external connection terminals in accordance with the line widthsof the light-emitting power source wiring lines 23R and the signal lines22, since the plurality of concave portions B are formed on the surfacesof the second external connection terminals 66 c, 70, 70, the secondexternal connection terminals 66 c, 70, 70 are also divided into aplurality of electrodes. It is very appropriate to accomplish theuniformity of the fixing condition.

[0198] In addition, the first interlayer insulating layers 284 areformed at the ends of the electrodes 73, 74, 75, so that the convexportions 79 are formed at the ends of the second external connectionterminals 66 c, 70, 70. The convex portions 79 have a function ofpreventing the conductive particles 41 b contained in the anisotropicconductive film 40 from protruding toward the side portion of the secondexternal connection terminals 66 c, 70, 70 when the display substrate 10and the relay substrate 20 are fixed using the isotropic conductive film40. As a result, since more conductive particles 41 b are disposed onthe second external connection terminals 66 c, 70, 70, it is possible toobtain an appropriate structure in which the electric resistance at thefixing portion 65 is greatly reduced.

[0199] Since the display substrate 20 of the present exemplaryembodiment described above is provided with a constitution for makingthe pressing condition at the fixing portion 65 uniform, the externalconnection terminal 34 formed on the relay substrate 30 which is fixedon the fixing portion 65 may be formed in the same line width as that ofthe light-emitting power source wiring lines 23R, the control signalwiring lines for the scanning line driving circuit 24 a and the like asshown in FIG. 6. However, in order to fix the relay substrate 30 and thedisplay substrate 20 under more uniform pressing condition, it ispreferable that the external connection terminals 34 have the samepattern as the second external connection terminals 66 c, 70, 70, andthe like formed on the fixing portion 65.

[0200] On the other hand, there is a tendency to make the firstinterlayer insulating layer 284 thick in order to reduce the problems indisplay such as non-uniformity of display and deterioration of contrastby reducing parasitic capacitance between the various wiring linesformed on the second interlayer insulating layer 283 and cathodes 26formed to cover the upper side (the side opposite to the substrate 60)of the substantial display region 62 and dummy region 63 as shown inFIG. 5.

[0201]FIG. 9 is an enlarged view of the second external connectionterminals 70, 70 in which first interlayer insulating layers 284 areformed to be thick. As shown in FIG. 9, if the first interlayerinsulating layers 284 between the electrodes 74, 75 become thicker, theheight of the convex portions 79 formed at the ends of the firstinterlayer insulating terminals 70, 70 becomes higher than that of theconvex portions 79 as shown in FIG. 8. Incidentally, the firstinterlayer insulating layers 284 are made of SiN in FIGS. 7 and 8, butthe first interlayer insulating layers 284 are made of SiO₂ in FIG. 9.

[0202] As shown in FIG. 9, since the thickness of the first interlayerinsulating layers 284 increases, the height of the convex portion 79formed at the ends of the electrodes 74, 75 become higher, and thus thethickness between the electrodes 74, 75 and the transparent electrode 77becomes thinner. In addition, when the first interlayer insulatinglayers 284 are directly formed on the second interlayer insulatinglayers 283 and the electrodes 74, 75, the convex portions 79 formed atends of the electrodes 74, 75 have protruding shapes toward the surfacesof the first interlayer insulating layer 284 between the first externalconnection terminals 70, 70 as well as toward the electrodes 74, 75.Accordingly, the planarity is deteriorated, and problems may occur whenthe relay substrate 30 is fixed by using the isotropic conductive film40.

[0203] In order to address or avoid such problems, in the presentexemplary embodiment, a planarization film to planarize the unevennessformed by the electrodes 74, 75 is provided. FIG. 10 is an enlarged viewof the first external connection terminals 70, 70 in which firstinterlayer insulating layers 284 are formed thickly and which areprovided with a planarization film between the electrodes 74, 75. Theplanarization film 80 is formed at parts other than the parts in whichthe electrodes 74 and the electrodes 75, etc., are formed before thefirst interlayer insulating layers 284 are formed.

[0204] Referring to FIG. 10, it can be noted that the first interlayerinsulating layers 284 are formed after the planarization film 80 isformed, so that the difference of altitude (step) between the surfacesof the first interlayer insulating layers 284 between the first externalconnection terminals 70, 70 and the convex portions 79 become small.Therefore, such problem can not occur when the relay substrate 30 isfixed by using the isotropic conductive film 40.

[0205] Although the electro-optical device according to an exemplaryembodiment of the present invention is described above, the terminalstructure can be applied to a display, such as a liquid crystal displaydevice, a plasma display device shown in FIG. 25, an inorganic ELdevice, an electrophoresis device, other than the organic EL(electroluminescence) device, as mentioned above.

[0206] Furthermore, although the mounting terminals formed in thedisplay is exemplified, the tape sides mounted on the mounting terminalsmay be formed by the same process as the present invention. That is, theexternal connection terminals of the display may have the same structureas the related art one and the tape (the relay substrate in thespecification) may be formed by the process described above.

[0207] Furthermore, if the electro-optical device described above, theelectronic parts such as a motherboard comprising CPU (centralprocessing unit), a keyboard, hard disc are assembled into a housing,the notebook type of personal computer 600 (an electronic apparatus)shown in FIG. 11 is manufactured. FIG. 11 is a schematic illustrating anexample of an electronic apparatus including the electro-optical deviceaccording to an embodiment of the present invention. In FIG. 9,reference numerals 601, 602, and 603 indicate a housing, a liquidcrystal display device, and a keyboard, respectively. FIG. 12 is aperspective view illustrating a mobile phone as another example ofelectronic apparatus. The mobile phone 700 shown in FIG. 12 includes anantenna 701, a receiver 702, a transmitter 703, a liquid crystal displaydevice 704, and a manipulation button portion 705, etc.

[0208] Furthermore, although the aforementioned exemplary embodiment isdescribed by illustrating a notebook computer and a mobile phone as anelectronic apparatus, the present invention is not limited to them, butcan be applied to electronic apparatuses such as a liquid crystalprojector, multimedia adaptive personal computer (PC) and engineeringworkstation (EWS), a pager, a word processor, a television, a viewfinder type or monitor direct view type of videotape recorder, anelectronic notebook, an electronic desk calculator, a car navigationdevice, a POS terminal, and a device provided with a touch panel, forexample.

[0209] [Advantages]

[0210] As described above, according to the present invention, since theplanarization film is formed between the first terminals, between thesecond terminals and between the first terminals and the secondterminals, and the insulating film is formed on the planarization filmat the ends of the first terminals and at the ends of the secondterminals, the level of the insulating layer formed at the ends of thefirst terminals and at the ends of the second terminals is not muchhigher than that of the surface of the insulating layer formed on theplanarization film, and thus it is possible to ensure the planarity,even when the insulating film is formed to be thick. As a result, anadvantage is provided that a connection failure is not generated in thewiring lines connected to the first terminals and the second terminals.

1. (Currently Amended) A method of manufacturing an electro-opticaldevice in which external connection terminals are formed, comprising: astep of forming the external connection terminals by applying liquidmaterial containing conductive material.
 2. (Currently Amended) Themethod of manufacturing an electro-optical device according to claim 1,wherein further including forming an insulating film having convexportions is formed on the external connection terminals and terminals,and applying the liquid material is applied to regions defined by theconvex portions.
 3. (Currently Amended) A method of manufacturing anelectro-optical device in which external connection terminals areformed, the external connection terminals being formed of a plurality ofconductive layers, the method of manufacturing an electro-optical devicecomprising: a step of forming at least one layer of the plurality ofconductive layers by applying liquid material containing conductivematerial.
 4. (Currently Amended) The method of manufacturing anelectro-optical device according to claim 3, wherein further includingforming the conductive layer formed as the uppermost layer of theplurality of conductive layers is formed by applying liquid materialcontaining conductive material.
 5. (Currently Amended) The method ofmanufacturing an electro-optical device according to any one of claims 1to 4 claim 1, wherein further including applying the liquid material isapplied using an inkjet method.
 6. (Currently Amended) Anelectro-optical device manufactured by a the method of manufacturing anelectro-optical device according to any one of claims 1 to 5 claim
 1. 7.(Currently Amended) An electronic apparatus comprising apparatus,comprising: an the electro-optical device according to claim 6.